Search results for "chip resistors"
hofer powertrain and ETH Zurich initiate GaN project
hofer powertrain announced the commencement of a research project in collaboration with the Swiss Federal Institute of Technology in Zurich (ETH Zurich), focusing on the development of a state-of-the-art multilevel Gallium Nitride (GaN) traction inverter.
WeEn Semiconductors releases advanced SiC technologies with TSPAK packaging
New families of silicon carbide (SiC) MOSFETs and Schottky Barrier Diodes (SBDs) in TSPAK packaging are being premiered by WeEn Semiconductors at PCIM Europe in Nuremberg (June 11-13).
Power Integrations revs up motor-drive offering
Power Integrations has enhanced its hardware-software bundle for brushless DC motors (BLDC) with the introduction of BridgeSwitch-2.
Synopsys accelerates trillion parameter HPC & AI supercomputing chip designs
Synopsys, Inc. announced the industry's first complete PCIe 7.0 IP solution, consisting of a controller, IDE security module, PHY, and verification IP.
Sondrel launches Outsourced Design Teams service
Sondrel, a provider of ultra-complex chips for leading global technology brands, is offering customers a solution to their shortage of engineers in the form of its Outsourced Design Teams (ODT) service.
Sondrel launches outsource design service
Sondrel has launched an outsource design team service to help customers overcome a shortage of skilled experienced engineers. Engagements can be as simple as one engineer for a few weeks to a complete team of, say, a dozen for many months.
Bourns introduces compliant automotive grade chip inductor series
Bourns, Inc. has introduced its Model CWP3230A Series chip inductors. These AEC-Q200 compliant automotive-grade inductors offer high current, inductance, and impedance in a compact form factor.
Blue chip suppliers feature for Avnet Silica at PCIM
Avnet Silica will be exhibiting power solutions from onsemi, ST, Renesas, Nexperia, Navitas Semiconductor, Diodes Inc and Monolithic Power Systems at PCIM Europe in Nuremberg (June 10-12).
Lab-grown diamond proposes to heat up the quantum tech market
Material innovations underpin many of the exciting applications offered by emerging quantum technologies.
ASMPT combine high-speed chip assembly with SMT placement
With its new SIPLACE CA2 hybrid placement solution ASMPT combines semiconductor and SMT production in a single machine that makes it possible to integrate the production of SiPs (system-in-package modules) directly into the SMT line.