Search results for "Silicon Labshttps://www.electronicspecifier.com/search?query=Silicon Labs"
Trident IoT announces new Zigbee chip and SDK
Trident IoT, an RF technology and engineering company focused on decreasing time-to-market for connected device manufacturers, has announced the upcoming release of its new Zigbee chip and accompanying Software Development Kit (SDK).
Allion Labs picks Keysight for Thunderbolt 5 testing
Allion Labs has selected Keysight Technologies as its test partner for Thunderbolt 5 product certification testing.
Nexperia invests $200m in Hamburg
Semiconductor manufacturer Nexperia has announced a USD 200 million (approximately 184 million Euros) investment to develop the next generation of wide bandgap (WBG) semiconductors, including silicon carbide (SiC) and gallium nitride (GaN), and to enhance production infrastructure at its Hamburg site.
Semidynamics reveals Tensor Unit efficiency for new AI IP
Semidynamics, the European RISC-V custom core AI specialist, has announced Tensor Unit efficiency data for its ‘All-In-One’AI IP running a LlaMA-2 7B-parameter Large Language Model (LLM).
What happened to Cambridge Silicon Radio Limited?
Cambridge Silicon Radio Limited (CSR) was a notable player in the semiconductor industry, specialising inwireless connectivitytechnologies.
Vishay Intertechnology Gen 3 1200 V SiC Schottky diodes
Vishay Intertechnology has introduced 16 new Gen 3 1200 V silicon carbide (SiC) Schottky diodes.
Top 5 IoT products in June
Electronic Specifier walks through the top 5 IoT products released this June 2024.
Synopsys’ multi-die reference flow accelerates chip innovation
Synopsys announces the availability of its production-ready multi-die reference flow, powered by Synopsys.ai EDA suite, and Synopsys IP for Intel Foundry's embedded multi-die interconnect bridge (EMIB) advanced packaging technology.
Siemens introduces Innovator3D IC
Siemens Digital Industries Software announces Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D and 3D technologies and substrates in the world.
NY Creates and CEA-Leti announce partnership
NY CREATES and CEA-Leti have announced a strategic collaboration focused on the research and co-development of magnetic memory devices, which are crucial for storing computer data.