Search results for "Photonic Microsystems"

A new European Union consortium created to accelerate the development of next-generation, Edge-AI technologies is installing cleanroom tools and gearing up to design, evaluate, test, and fabricate new circuits from across Europe.

IDTechEx discusses its latest findings in advanced semiconductor packaging trends in AI and HPC.

Engineers at the University of Pennsylvania have made an advancement in the field of AI with the development of a chip that leverages light waves for computation, rather than traditional electricity.

At this week’s IEEE International Solid-State Circuits Conference (IEEE ISSCC2024), imec, a global research and innovation hub in nanoelectronics and digital technologies, introduces a breakthrough architecture that lays the foundation for a whole new generation of analog-to-digital converters (ADCs)

Hamamatsu Photonics has introduced its new C16741-40U InGaAs camera featuring high resolution, small pixel, and low readout noise.

Parker Hannifin’s Filtration business has reached a major milestone on the journey towards mass production of hollow fibre membrane technology for fuel cell humidification applications, a vital step towards reducing carbon emissions.

LASER COMPONENTS is thrilled to introduce its latest achievement in detector technology at SPIE Photonics West 2024.

New funding and support has been unveiled to back British scientists working on chip development, which could power advancements in AI and underpin the technologies needed to reach net zero.

Keysight Technologies introduces the InfiniiMax 4 Series high-bandwidth oscilloscope probes, expanding its portfolio of high-frequency probes to cover bandwidths up to 52 GHz. As the industry's only solution with a high-impedance probe head operating at more than 50 GHz, the InfiniiMax 4 series provides digital designers with a turn-key probing solution for high-speed digital, semiconductor, and wafer applications.

Quantifi Photonics has announced the launch of its QCA Series High-Speed Communication Analyzer at DesignCon 2024. This development marks a significant step forward in advancing interconnect technologies for high-volume manufacturing, particularly in the fields of AI, High-Performance Computing, and Cloud applications.