Search results for "Infineon"
Infineon First Semiconductor Supplier to Offer “80 PLUS Platinum” Compliant Computing Silver Box Reference Design
Infineon Technologies has developed the first marketable silver box reference design that enables PC and server power supply units to achieve up to 92.35 percent efficiency, while significantly reducing the material costs. Infineon’s solution IFX90ATX300W is based on the latest generation of three ICs (Integrated Circuits) and meets the industry’s highest energy efficiency standard: “80 PLUS® Platinum”. Efficiency indicates what share of...
Halving Energy Losses with New Semiconductor Materials for the Benefit of Renewables, Telecommunications and Lighting Systems
Six partners from the semiconductor and solar industries are joining forces in the NEULAND project funded by the Federal Ministry of Education and Research (BMBF) to explore new avenues for the efficient use of electricity from renewable sources. NEULAND stands for innovative power devices with high energy efficiency and cost effectiveness based on wide bandgap compound semiconductors. The project aims to reduce the losses in feeding electricit...
New, Extremely Fast-Acting Diode Protects High-Speed USB 3.0 Ports from Electrostatic Discharge While Maintaining Optimum Signal Quality
With today’s portable storage media, anyone can take their own media library with them wherever they go – everything from the latest album release by their favorite band to last summer’s vacation photos and even HD-quality movies that can be played back in an instant on end-user equipment like televisions and laptop computers. The better the picture and audio quality, though, the greater the quantity of data to be transferred between the de...
Infineon Makes 2nd Generation of its ThinQ! Silicon Carbide Schottky Diodes Available in Fully Isolated TO-220 FullPAK Package
Infineon Technologies today announced the availability of its 2nd generation SiC (Silicon Carbide) Schottky diodes in the TO-220 FullPAK package. The new TO220 FullPak portfolio combines the high electrical performance standards of the 2nd generation ThinQ! SiC Schottky diodes with the advantages of a fully isolated package, including easier and more reliable mounting without having to use isolating bushing and foil.
Implementing Complex Motor Control Algorithms with a Standard ARM Processor Core
In the real-time MCU world, cost-effective complex motor control designs have been dominated by specialized cores. In many cases dual-core systems have been used, with the main core handling the control algorithm and a second “mini” core managing the real-time I/O and data manipulation. By Mike Copeland, Senior Staff Applications Engineer, Infineon Technologies.
German Research Project CoSiP Lays Foundation for Simultaneous Development of Chip, Package and PCB Board for System-in-Package Applications
The growing complexity of microelectronic systems makes it necessary to align and coordinate the development of chips, packages and boards at a very early stage, especially when it comes to system-in-package (SiP) applications.
Infineon to Receive the Highest Level Quality Award from Toyota Hirose Plant
Infineon Technologies announced that the Hirose plant of the Toyota Motor Corporation awarded Infineon the ”Honor Quality Award”, its highest level award for delivering extraordinary product quality. This is the first time ever that a non-Japanese company was honored with a “Honor Quality Award” and Infineon is the only recipient of the award in 2010. Infineon was recognized for providing CAN transceivers with zero-defect quality for fou...
Infineon Wins Bavarian State Award for Electric Mobility
Infineon Technologies has won the Bavarian State Award for Electric Mobility. Martin Zeil, Bavarian Minister of Economics, Infrastructure, Transport and Technology, presented the award to Peter Bauer, CEO of Infineon Technologies AG, yesterday evening. The ceremony at which the awards were conferred in altogether seven categories was held alongside the eCarTec International Trade Fair for Electric Mobility in Munich. The award went to Infineon in...
Infineon to Supply Next Generation of Security Controllers for German ID Cards, Europe’s Biggest ID Project
Infineon is supplying its next generation of security controllers of the SLE 78 product family for the new German ID card. The German authorities have been issuing the new electronic ID in chip card format since November 1, 2010. Infineon is providing a significant share of the chips for Europe’s biggest ID project. Currently, around 60 million German ID cards are in circulation, usually valid for ten years. About 6.5 million ID cards are issue...
New XMM2138 Platform from Infineon Supports Growing Dual-SIM Market
To address the growing Dual-SIM (Subscriber Identity Module) market Infineon Technologies today launched its new XMM2138 platform, supporting Dual-SIM operation. Dual-SIM mobile phones enable simultaneous use of two SIMs in the handset, with features like call hold and swap to provide real-time switching facility between both SIMs at the touch of a button. Today there is a high growth rate for Dual-SIM phones in the BRIC (Brazil, Russia, India, a...