Search results for "Infineon"

To address the growing Dual-SIM (Subscriber Identity Module) market Infineon Technologies today launched its new XMM2138 platform, supporting Dual-SIM operation. Dual-SIM mobile phones enable simultaneous use of two SIMs in the handset, with features like call hold and swap to provide real-time switching facility between both SIMs at the touch of a button. Today there is a high growth rate for Dual-SIM phones in the BRIC (Brazil, Russia, India, a...

With its latest generation of high-voltage CoolMOS MOSFETs Infineon is rolling out another innovation setting new standards in the field of energy efficiency. At the PCIM Europe 2011 (May 17-19) in Nuremberg, Germany, Infineon presents the new 650V CoolMOS™ CFD2 – the world`s first high-voltage transistor with both a drain-source voltage of 650V and an integrated fast body diode. The new CFD2 devices succeed the 600V CFD products, enabling no...

In a joint effort to secure the future of Altis Semiconductor and its employees, IBM (NYSE:IBM) and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today closed a transaction to sell 100% of the share capital of Altis Semiconductor to the new corporation Altis International. IBM and Infineon said this completes the divestment of their joint venture Altis Semiconductor in France.

Peter Bauer, former Spokesperson of the Management Board, has been appointed Chairman of the Board with immediate effect. Chief Financial Officer and Labor Director Dr. Marco Schröter has left the Management Board of Infineon Technologies AG with immediate effect. This was caused by differences in opinion over future company policy.

Infineon Technologies announced the availability of XMM™6260, the latest platform in its 3G slim-modem family. The XMM 6260 platform is optimized as a slim-modem for smart phone architectures coupled with an application processor or as a standalone solution for PC modems and data cards. This advanced HSPA+ platform is based on two new highly integrated Infineon devices: the X-GOLD™626 baseband processor and the SMARTi™UE2 Radio Frequency (R...

The COM Express module family CXB-GM45 in the “basic” format 125 x 95mm offered by MSC Vertriebs GmbH shows considerable performance leaps by means of computing power, graphics and memory technology compared to the previous platforms. The compact platform is based on single-core and dual-core processors from Intel‘s embedded low power Penryn generation, all built in 45nm technology, and the Intel® GM45 graphics and memory controller hub (...

At the International Electron Devices Meeting in San Francisco imec’s advanced CMOS research program reports promising advances in scaling logic, DRAM and non-volatile memory. A new device based on non-silicon channels was realized to scale high-performance logic towards the sub-20nm node. Moreover, imec developed low-leakage capacitors allowing DRAM to be pushed to the 2x nm node. And the switching mechanism of resistive RAM for next-generatio...

Imec sets major step towards 20nm half pitch interconnects with the realization of electrically functional copper lines embedded into silicon oxide using a spacer-defined double patterning approach.