Search results for "Renesas"

Renesas Technology Europe today announced the availability of the SH77722 (SH-NaviJ2) device, the second-phase product in its SH-NaviJ car navigation SoC (System on Chip) series. Designed for compact portable navigation systems and low-end through middle-range dashboard-mounted car navigation systems, the device offers even higher performance and improved ease of use compared to the first product in the series, in a 17% smaller package.

Renesas Technology Corp. has announced a variety of structural reforms that will be undertaken to reinforce its business structure as part of the company’s key strategy in achieving growth from FY2009 onward.

Renesas Technology Europe and its Gold Alliance Partner Thesycon have announced the immediate availability of a complete USB stack to support the Renesas Starter Kit (RSK) RSKM16C/6C, based on the M16C/6C. The M16C/6C is a part of the popular M16C microcontroller platform with added support for USB 2.0. The M16C/6C product group includes a total of 16 different models, and the new components are completely compatible with earlier versions.

Renesas Technology Europe today announced the HD Video Middleware, which will facilitate the development of applications for the SH-Mobile application processor supporting recording and playback of video in the 1280 × 720-pixel High Definition (HD) resolution. The new middleware will be available from April.

Renesas Technology Europe today announced that it will shortly release an updated version of its power line communications-based (PLC) Renesas Ubiquitous Network – Metering (RUN-M) network layer software. Designed for automatic meter reading (AMR) applications, the new software, RUN-M (RF), will incorporate wireless extensions that conform to the IEEE 802.15.4 MAC layer standard. Using a wireless approach will now allow AMR applications to not ...

Renesas Technology Corp., Fujitsu Limited, and Sharp Corporation today announced that they plan to jointly develop the SH-Mobile G4 single-chip LSI device, and a platform incorporating it, to support the HSUPA1/HSDPA2/W-CDMA and GSM/GPRS/EDGE (2G) mobile telephony standards. Development of the platform is targeted for completion by the forth quarter of fiscal 2009 (January–March 2010).

Renesas Electronics Corporation today announced that Renesas Electronics, Renesas Northern Japan Semiconductor, Inc. and Fuji Electric Co., Ltd have signed an agreement to transfer Renesas Northern Japan Semiconductor’s Tsugaru factory (Goshogawara, Aomori) to Fuji Electric. The companies plan to complete the transfer on July 1, 2012.

Renesas Electronics Europe and the University of Glamorgan have announced the official opening of the Renesas Embedded Systems Laboratory for electronics engineering students within the University’s Faculty of Advanced Technology. The two organisations have been working together for the past five years with Renesas making regular donations of development tools and microcontrollers. The ongoing support from Renesas and the productive relationshi...

Renesas announced that it has joined the DALI AG (Digital Addressable Lighting Interface Activity Group), a working group formed in Germany by leading manufacturers and organizations in the field of digital control of lighting systems to promote DALI technology and applications. As the first semiconductor supplier to be an active member of the DALI AG, Renesas Electronics will help develop DALI specification and establish the DALI standard to dr...

Renesas Electronics and its subsidiary, Renesas Mobile Corporation, an innovative supplier of advanced cellular semiconductor solutions and platforms, today announced the availability of the high performance 3D mobile platform, the MP5225, which builds on Renesas Mobile’s vision of delivering an unrivalled connected experience. The new mobile platform integrates Renesas Mobile’s industry reference LTE triple-mode modem platform, the SP2531, w...