Search results for "Infineon"

Infineon Technologies AG today announced that Hyundai Motor Company and Kia Motors Corporation have selected Infineon as supplier of power modules for their current hybrid car generations, the Hyundai Sonata Hybrid and Kia Optima. Hyundai and Kia, together the world’s fastest-growing and fifth-largest car manufacturer, teamed up with Infineon on the hybrid powertrain design including the Infineon HybridPACK™1 power module and the related cont...

Fairchild Semiconductor Corp and Infineon Technologies AG today announced a licensing agreement on Infineon’s advanced automotive MOSFET packaging technology H-PSOF (Heatsink Plastic Small Outline Flat Lead), a JEDEC standard TO-Leadless (TO-LL) package (MO-299).

According to a new report, Opportunities for System and Semiconductor Manufacturers in Hybrid and Battery Electric Vehicles, global production of electric cars – either hybrids, plug-in hybrids, battery electric or fuel cell vehicles – will better 16 million in 2021, and will account for 16 percent of all vehicles manufactured.

Even today, a medium-sized vehicle contains about 1,000 chips and as many as 80 networked electronic systems. These numbers are set to grow as state-of-the-art safety technology gains traction – for example, driver assistance systems that help to prevent hazards such as rear-end collision in fog. The tight design envelope of a car means that existing systems have to become ever smaller and new ones have to be as compact as possible. This is whe...

The project team supported by the Federal Ministry of Economics and Technology works on integrating hybrid power electronics into the transmission. This will make hybridization of volume production vehicles easier and more cost-efficient spanning all manufacturers.

Infineon launched its new AUDO MAX family of 32-bit microcontrollers (MCUs) for automotive powertrain and chassis applications. The AUDO MAX family supports design of engine management systems meeting the strict Euro 5 and Euro 6 emission standards for combustion vehicles and enables the electrification of powertrain functions in electrical vehicles. Key features of the AUDO MAX family are maximum clock frequencies of up to 300MHz, high-speed in...

Symtavision, has announced that SymTA/S supports the timing design and verification of embedded software developed for the new multicore AURIXTM microcontroller family from Infineon Technologies.

Aonix, the provider of the PERC product line for embedded and real-time Java developers and SYSGO, a leading supplier of software solutions for safety and security applications, announced their collaboration in the Trusted Embedded Computing initiative. Aonix will provide the PERC Ultra virtual machine and its expertise in security and complex embedded systems and SYSGO will provide PikeOS MILS compliant and safe and secure virtualization experti...

GOEPEL electronic introduces TIC020, another TAP Interface Card (TIC) within the frame of the JTAG/Boundary Scan hardware platform SCANFLEX. The new TIC module features a programmable multi bus interface, which enables a nearly unlimited compatibility to numerous standardised and proprietary test and debug protocols and, consequently, several thousand micro controllers.

Infineon Technologies AG and Mitsubishi Electric Corporation, agreed to establish a service agreement by which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages SmartPACKs and SmartPIMs. This revolutionary package concept, recently developed by Infineon Technologies, will be available with the latest generation of power chip technologies from the two leaders.