Search results for "nexperia"

Nexperia has announced that key parts from its SOT23-packaged family of high-performance, general-purpose transistors and switching diodes are now fully-specified for operation up to 175°C. Included in the range are high-speed switching diodes BAS16/21 and BC807/817 general purpose transistors.

Nexperiahasextended its constant current LED driver family with eight new AEC-Q101 qualified devices to drive low- and medium-power LEDs up to 250mA. The 16V NCR32xx and 40V NCR42xx series are available in two package styles, the space-saving SOT457 (SC-74) and the SOT223 (SC-73), a slightly-larger option which delivers a higher power capability of up to 1,250mW.

Specialist in discretes, logic and MOSFET devices, Nexperia, has announced that its lowest-ever RDS(on) NextPower S3 MOSFETs in Trench 11 technology has been achieved without compromising other important parameters such as drain current (ID(max)), Safe Operating Area (SOA) or gate charge QG.

Specialist in discretes, logic and MOSFET devices, Nexperia, has announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified. These logic solutions claim to be the smallest devices of their type suitable for automotive applications and Nexperia’s Q100 portfolio exceeds the Automotive Electronics Council’s requirements.

This year’s PCIM Europe was attended by a record number of visitors, over 12,000. Over half (54%) were from outside Germany. They came to see over 500 exhibitors and while the subject matter was diverse and wide-ranging, there were some themes that emerged. GaN and SiC jostled for attention at this year’s PCIM Europe, writes Caroline Hayes, alongside current sensor developments designed to accelerate adoption rates for electric vehicl...

Global specialist in discretes, logic and MOSFET devices, Nexperia, has introduced a portfolio of low RDS(on) 40V AEC-Q101 MOSFETs targeting space-constricted, increased-power modules in demanding powertrain applications. Housed in the miniature, LFPAK33 package which has a footprint of only 10.9mm² and a pitch of just 0.65 mm, devices use Nexperia’s Trench 9 technology.

Set to be published and presented later this month in The McClean Report 2019, IC Insights is in the process of completing its forecast and analysis of the IC industry. Among the semiconductor industry data included in the new 400+ page report is an analysis of semiconductor merger and acquisition agreements.

Nexperia has announced the industry’s first AEC-Q101-qualified MOSFETs that are both rated for use at up to 175°C and are available in the AOI-compatible DFN2020 package. More, the devices measure just 2mm x 2mm, much smaller and lighter than SOT223 and SO8-packages yet with comparable electrical and thermal performance.

Nexperiahasannounced the four pin X2SON4 package which is the smallest logic package that can be used without requiring an expensive and fragile step-down mask. Therefore, PCB assembly is quicker, easier, more reliable and more cost effective.

Nexperia hasannounced that it has optimised its TrEOS ESD protection diode series for use with USB Type-C interfaces. The new USB3.2 standard introduces an optional capacitor at the Rx inputs, so Nexperia is now launching two groups of devices, one that delivers extremely high surge robustness for positioning between the connector and capacitor, and a second that has an extremely low trigger voltage for placement between capacitor and the system ...