Search results for "miniaturisation"

For signals, data, and electrical power: M12-type connectors have become indispensable interfaces for device connectivity. binder is supplementing its M12 lines with additional products that support users in automation technology to achieve efficient, flexible, and error-free installation.

Fraunhofer Institute for Photonic Microsystems IPMS believe digitalisation, automation and efficiency are the buzzwords of the industry of the future. To this end, the Fraunhofer Institute for Photonic Microsystems IPMS develops customer-specific sensors, actuators and optical components. These represent the key technologies for IoT and numerous future applications with artificial intelligence, it claims.

ROHM has developed an isolated flyback DC/DC converter, BD7Fx05EFJ-C (BD7F105EFJ-C, BD7F205EFJ-C) optimised for gate driver power supplies in xEV applications such as electric compressors, and PTC heaters.

During the upcoming LOPEC trade show on the 1st and 2nd of March in Munich Henkel will display its range of functional material innovations for printed electronics together with its broad ecosystem of partners.

Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place 25th to 27th January 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Pickering Electronics brings new ideas to reed relay market as it enters 55th year

Pickering Electronics, the reed relay company which has pioneered miniaturisation and high performance for over 55 years, now offers optional electrostatic shielding for its 10kV stand-off Series 67/68 SIL/SIP reed relay families.

We are pleased to announce that more microcontroller and LED manufacturers as well as suppliers of measurement systems and modules have joined the ISELED Alliance: Blue Whale, Lextar, LITEON, Technica, USI/Asteelflash, and YTMicro. This brings the current number of companies in the open industry alliance to 52.

SABIC launched a new grade of ULTEM resin that can assist designers in elevating the styling and aesthetics of consumer electronics components while reducing costs by approximately 25% compared to metal.

It is estimated that over half of the printed circuit boards (PCBs) made today use no-clean solder paste during assembly. Some PCB fabricators believe that it speeds up the production process by removing the need for cleaning circuit boards after reflow.