Search results for "geometry"

Kontron has announced that it will present its newsmall SoM module based on the latest processor and memory technology at the embedded world trade fair in Nuremberg. The new SoM SL i.MX8M Mini provides an excellent and cost-effective basis for individual board and application developments.

Many industrial processes rely on compressors for a host of essential tasks, from powering machinery to squeezing industrial gases for storage and transportation. When one of its main compressors failed, a company in the Philippines faced high costs and the prospect of a long wait for a critical replacement part. That’s when it turned to Sulzer for help.

Smart Production Solutions – SPS, formerly known as SPS IPC Drives, brought companies together once again to share and inform customers and visitors about the very latest in digital transformation, with a particular focus this year on Artificial Intelligence.

IC Insights recently released itsGlobal Wafer Capacity 2020-2024report that provides in-depth analyses and forecasts of IC industry capacity by wafer size, by process geometry, by region, and by product type through 2024. Typically, the IC industry meets most of its IC unit demand by increasing wafer starts, not by dramatically increasing the number of dice per wafer. The number of good ICs shipped per wafer increased by an average of only 0.9% a...

Electrolube is set to launch an innovative range of UV Conformal Coatings, Thermal Management solutions and Encapsulation Resins at this year’s IPC APEX EXPO, at the San Diego Convention Centre, CA, from 4-6th February.The company’s commitment to the evolving needs of its customers saw the launch of these new products reach an unprecedented level of success at Productronica recently, where Electrolube’s newly redesigned stand hi...

Hitaltech hopes that its Conex-it range of wire to board interconnect products will continue to be the first choice for manufacturers of white goods, automotive, industrial control and energy metering systems (amongst many others). Now, the company is adding a whole new element to its Conex-it range.

For the manufacture of semiconductors, the cleaning of metal surfaces before wire bonding or injection moulding of the semiconductor housing is still an important and necessary step. Contaminated and oxidised metal surfaces can cause low wire bond strength and lead to failures due to interruption of the electrical contacts.

Gerard Young, Applications Engineering Team Leader, Parker Hannifin – Chomerics Division Europe, explains that 3D printing for prototyping EMI housings and gaskets is breaking new ground.

Mouser Electronics has sealed a global distribution agreement with Bend Labs, a technology company on a mission to bring motion and position measurement and understanding to the world through soft, flexible sensing solutions.

Release 14is the latest upgrade to Future Facilities 6SigmaET thermal simulation software. It includes significant modelling and optimisation enhancements, including the company’s ‘fastest ever’ CFD solver. The key focus of development for Release 14 was improvements in optimisation, allowing electronics engineers to balance thermal requirements with design constraints such as weight, size and cost.