Search results for "carbon"

ITEC has introduced the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines, attaching up to 60,000 flip-chip dies per hour.

Among the emerging areas for Printed Electronics (PE), wearables and automotive industries are rapidly adopting this technology on a commercial scale.

X-FAB and Soitec are set to collaborate on offering Soitec’s SmartSiC wafers for the production of silicon carbide power devices at the former's facility in Lubbock, Texas.

X-FAB (Euronext Paris), a global pure-play foundry pioneer serving a large variety of fabless customers, and Soitec (Euronext Paris), one of the leaders in designing and manufacturing innovative semiconductor materials, will begin work to offer Soitec’s SmartSiC wafers for the production of silicon carbide power devices at X-FAB’s plant in Lubbock, Texas.

MHI Thermal Systems, a part of MHI Group, received the 51st (2023) Technology Award from the Japan Society of Refrigerating and Air Conditioning Engineers (JSRAE) for its "e-3D scroll" compressor, a large-capacity, high-efficiency scroll compressor equipped with the "e-3D scroll” featuring a proprietary, advanced 3D compression structure. The award was presented in recognition of how the development of "e-3D scroll" provides a substantial i...

Leading power semiconductor companies will be discussing the latest power semiconductor development trends and innovations, and how these are helping the drive toward greener electronics, at the upcoming PowerUP Asia 2024 virtual conference.

OMRON Corporation will begin providing carbon footprint data of products (PCF) calculations based on global standards for high-capacity power relays for energy storage systems and other new equipment to customers from May 2024.

Smart Factory Expo, part of Smart Manufacturing & Engineering Week 2024, will host the Made Smarter Innovation Showcase at this year’s event bringing the latest bleeding edge industrial technology to Birmingham’s NEC on the 5th and 6th June.

The Royal Academy of Engineering will host the final of the 10th Africa Prize for Engineering Innovation, the continent’s largest engineering prize, on 13th June 2024 in Nairobi, Kenya.

Wearable sensor patches are revolutionising healthcare and wellness applications by providing continuous monitoring with optimal comfort and reliability.