Search results for "SEMICON Europa"
LEM invests in additional R&D capabilities in Europe and Asia
To meet the rising global demand for current and voltage sensing, driven by the global shift toward decarbonisation and electrification, LEM, a leader in electrical measurement technology, has opened new research and development centres in Munich, Germany, and Shanghai, China. These facilities are key to LEM’s strategy of integrating greater intelligence into its sensors while ensuring closer proximity to key customers, promoting deeper col...
Panellists announced for electronica Women in Tech forum
Electronic Specifier has partnered withWomen in Electronicsto launch a dedicatedWomen in Tech forum at electronica 2024.
InnoPhase IoT adds Matter v1.2 to STM32U5 with Talaria TWO Wi-Fi platform
InnoPhase IoT, a fabless semiconductor company specialising in ultra-low power Wi-Fi IoT solutions, and an ST Authorised Partner announces the availability of Matter v1.2 platform combining STM32U5 and its Talaria TWOTM Wi-Fi solution.
Anritsu tackles high-speed digital challenges at ECOC 2024
Anritsu will use the upcoming ECOC 2024 in Frankfurt, Germany, Sept. 23-25, to demonstrate solutions to the challenges arising from the rapid growth in global data traffic.
Memory company to rebrand as RAMXEED
Fujitsu Semiconductor Memory Solution is changing its name to RAMXEED from January 1, 2025.
Electronics Excellence Award announces new lineup of judges
At electronica 2024, Electronic Specifier will once again be celebrating the very best of the industry with itsElectronics Excellence Award.
Alpha and Omega Semiconductor’s new LFPAK 5x6 package
Alpha and Omega Semiconductor has announced its new highly robust power MOSFET LFPAK 5x6 package.
xMEMs unveils cooling chip for AI applications
xMEMS Labs have unveiled its latest groundbreaking innovation: the xMEMS XMC-2400 µCooling chip. This is the industry’s first all-silicon, active micro-cooling fan, designed for ultramobile devices and next-generation artificial intelligence (AI) applications.
NXP Semiconductors FRDM-MCXN236 Development Board
The NXP FRDM-MCXN236 board combines one MCXN236 with a 64Mbit external serial flash supplied by Winbond. The board offers a high-speed USB circuit, one FXLS8974CFR3 accelerometer sensor, TJA1057GTK/3Z CAN PHY, DA7212 Audio codec (DNP), DMIC sensor SPK0641HT4H-1, RGB LED, push buttons, and MCU-Link debug probe circuit. The board is compatible with Arduino shield modules and mikroBUS headers.
Wide bandgap semiconductors: GaN or SiC?
With wide bandgap semiconductors like Gallium Nitride (GaN) and Silicon Carbide (SiC) growing in popularity, it begs the question: GaN or SiC?