Search results for "Master Bond"
Disabled adventurer conquers Snowdon in groundbreaking mobility chair
In celebration ofDisability Pride Month, mental health campaigner and disabled adventurer Nick Wilson has achieved a remarkable feat by reaching the highest accessible point on Yr Wyddfa (Mount Snowdon) ‘unaided’.
Indium introduces Au-based precision die-attach preforms
Indium Corporationis proud to introduce new, high-reliabilityAu-based Precision Die-Attach (PDA) Preforms.
Adeia wins ECTC Award for “Fine Pitch Die-to-Wafer Hybrid Bonding” paper
Adeia was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on May 28-31, 2024. Find more industry awards, here.
Eight pioneers chart a sustainable future for UK manufacturing
Digital Catapult, the UK authority on advanced digital technology, has welcomed eight technology pioneers to the‘Made Smarter Innovation Sustainability Accelerator’to improve resource and energy efficiency in UK manufacturing.
Nearfield Instruments' QUADRA validated for high-volume semiconductor metrology
Nearfield Instruments B.V., a provider ofprocess control metrology solutionsfor advanced semiconductor devices, has launched ‘Lightning Mode’, a new feature for QUADRA, which is the semiconductor industry’s highest-throughput atomic force microscopy (AFM) metrology system for advanced semiconductor devices.
CAMTEC launches Industry 4.0-ready power supply series
With its new CPS-i series, CAMTEC Power Supplies sets new standards for highly robust, space-saving, precise, and cost-efficient power supplies for uninterrupted industrial and infrastructural processes.
Smiths Interconnect to exhibit at Farnborough Airshow
Smiths Interconnect is pleased to announce its participation in the upcoming Farnborough International Air Show.
High-end performance packaging: breaking performance barriers?
Breaking the high-end packaging market down by end markets, the largest segment is telecom and infrastructure, which accounted for over 67% of the revenue in 2023.
KIOXIA introduces high capacity 2Tb QLC flash memory
KIOXIA Europe has announced the commencement of sample shipments for its 2Tb (terabit) Quad-Level-Cell (QLC) memory devices, utilising its eighth-generation BiCS FLASHTM 3D flash memory technology.
element14, Analog Devices and Tektronix host webinar
element14, an Avnet Community, is hosting “Precision converter design masterclass with Analog Devices and Tektronix,” a free webinar, on Tuesday, 9th July at 10 am CDT/ 3pm BST.