Search results for "infineon"

STMicroelectronics the leader of the EU Sixth Framework Program PULLNANO Advanced Technology Research and development project, today announced that PULLNANO has been selected and invited to be demonstrated at ICT 2010, an event organized by the European Commission and hosted by the Belgian Presidency of the European Union, to be held on September 27-29, 2010 in Brussels.

STMicroelectronics has increased the power density achievable with its latest generation MDmesh V power MOSFET technology by introducing an advanced high-performance power package.

Fairchild Semiconductor and Infineon Technologies today announced the extension of their compatibility partnership to encompass Fairchild's 5x6mm power stage asymmetric dual MOSFET package. Fairchild’s PowerTrench power stage dual asymmetric MOSFET modules are part of a comprehensive portfolio of advanced MOSFET technology that provides power designers with a wide range of solutions for mission critical high efficiency information processing de...

The National Microelectronics Institute (NMI), the trade association representing the semiconductor industry in the UK and Ireland, has announced the creation of a Design Advisory Board to oversee its development of strategy and implementation plans for the semiconductor design community.

As a result of the very early and close cooperation with Infineon Technologies and several key customers, PLS now presents the first optimized test and debug solution, the Universal Debug Engine (UDE) 3.3, for the new multi-core architecture of the 32-bit microcontroller family AURIX.

PLS Programmierbare Logik & Systeme now introduces its Universal Debug Engine (UDE) 3.1.7., the first debugger solution for the new 32-bit multicore architecture, which Infineon Technologies AG introduced in October of this year. This solution is the result of a very early and close cooperation of Infineon with PLS as tool partner.

The two-day event and networking dinner, supported by Dyson, will focus on how future products can integrate interconnectivity, intelligence and thermal management to better meet the needs of renewable power generation, electric vehicles, smart transportation systems and other applications. Presentations will be given on scenario and application directions; power electronics technology developments; materials and processes; and manufacturing and...

Achieving another wireless connectivity milestone, Texas Instruments Incorporated today introduced the WiLink 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi, GNSS, NFC, Bluetooth and FM transmit/receive applications.

Infineon Technologies has introduced a new series of Receive Front-End Modules for implementation of Global Navigation Satellite System (GNSS) functionality in Smart Phones and other handheld devices. The new BGM103xN7 Series devices are the first modules available that support separate or simultaneous reception of both Global Positioning System (GPS) and Globalnaya Navigatsionnaya Sputnikovaya Sistema (GLONASS) signals.

Infineon Technologies AG today introduced its 32-bit microcontroller (MCU) multicore architecture. The new architecture is the foundation of Infineon’s next generation MCU family that will fulfill the requirements of upcoming automotive powertrain and safety applications. The multicore architecture features up to three processor cores to share the application load, introduces lockstep cores and contains further enhanced hardware safety mechanis...