Search results for "Infineon"

Aeroflex has announced it will deliver a non-signaling PXI solution customized for RF production line test of Infineon’s second-generation ultra low-cost mobile phone platform. The solution, based on the Aeroflex PXI 3000 Series, will test Infineon’s second-generation ultra low-cost chipset (X-GOLD 101).

For safety-critical applications in compliance with SIL (IEC 61508) or ASIL (ISO 26262) Hitex now offers the safety library SaveTcore for Infineon’s TriCore microcontrollers.

Some years ago Hitex published the first Insider's Guide as an Engineer's Introduction to the C166 Family. It was the beginning of a success story: Thousands of engineers all around the world could benefit from the useful information given in printed form or pdf format.

RF Micro Devices, Inc. today announced the addition of four new products to RFMD's portfolio of 3G transmit modules. The four new products – the RF3230, RF3231, RF3232, and RF3171 – are designed to accelerate the implementation of 3G entry-level feature phones supporting one-to-two bands of WCDMA and two-to-four bands of GSM/GPRS (also referred to as WGPRS). Each new transmit module (TxM) features a GSM/GPRS power amplifier (PA) and an integr...

Atollic a annoncé aujourd'hui l’ajout d'un support spécialisé pour les microcontrôleurs ARM Cortex-M0 et Cortex-M3 de la famille NXP dans son programme primé Atollic TrueSTUDIO destiné à l'environnement de développement ARM C/C++.

CSR today announced that it is collaborating with Infineon Technologies to pre-integrate its wireless connectivity platforms onto Infineon’s cellular reference designs. This new cooperation allows mobile phone OEMs to easily add connectivity functionality beyond Infineon’s existing product portfolio to their products. The pre-integration of the complete functionality into a reference design significantly reduces development costs and time to ...

Even today, a medium-sized vehicle contains about 1,000 chips and as many as 80 networked electronic systems. These numbers are set to grow as state-of-the-art safety technology gains traction – for example, driver assistance systems that help to prevent hazards such as rear-end collision in fog. The tight design envelope of a car means that existing systems have to become ever smaller and new ones have to be as compact as possible. This is whe...

Germany’s foreign trade success is determined to an ever-increasing degree by the quality and reliability of high-tech products. Seven partners from the German business and research communities are teaming up in the three-year “RELY” project to explore ways of enhancing the quality, reliability and resilience of modern microelectronic systems. The focus will be on applications in transportation, in particular electromobility, in medical tec...

Infineon Technologies AG today introduced automotive qualified 100 percent lead-free power MOSFETs for TO package types. Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS T2 power MOSFETs offer best-in-class specifications. Infineon uses a diffusion soldering die attach approach to produce the lead-free packages that include TO-220, TO-262 and TO-263. Because of specifi...

Analysis of findings from Semicast’s Embedded Processing Service and Automotive Electronics & Entertainment Systems Service shows that ARM maintained its position as the leading architecture for 32-bit embedded processors in the automotive sector in 2011, ahead of Power Architecture, SH, TriCore and V850. The data also suggests that ARM’s lead in this sector is set to increase significantly over the next five years.