Search results for "Infineon"
Fairchild Semiconductor and Infineon Technologies Reach License Agreement for Innovative Automotive MOSFET H-PSOF TO-Leadless Packaging Technology
Fairchild Semiconductor Corp and Infineon Technologies AG today announced a licensing agreement on Infineon’s advanced automotive MOSFET packaging technology H-PSOF (Heatsink Plastic Small Outline Flat Lead), a JEDEC standard TO-Leadless (TO-LL) package (MO-299).
IMS Research Forecasts Global Electric Car Production to Top 16 Million in 2021, 16-Fold Increase from 2010
According to a new report, Opportunities for System and Semiconductor Manufacturers in Hybrid and Battery Electric Vehicles, global production of electric cars – either hybrids, plug-in hybrids, battery electric or fuel cell vehicles – will better 16 million in 2021, and will account for 16 percent of all vehicles manufactured.
HONEY Lays the Cornerstone for Highly Complex Driver Assistance Systems in Medium-Sized Vehicles; HONEY Research Project Successfully Concluded
Even today, a medium-sized vehicle contains about 1,000 chips and as many as 80 networked electronic systems. These numbers are set to grow as state-of-the-art safety technology gains traction – for example, driver assistance systems that help to prevent hazards such as rear-end collision in fog. The tight design envelope of a car means that existing systems have to become ever smaller and new ones have to be as compact as possible. This is whe...
Cost-effective Passenger Car Hybridization With ZF
The project team supported by the Federal Ministry of Economics and Technology works on integrating hybrid power electronics into the transmission. This will make hybridization of volume production vehicles easier and more cost-efficient spanning all manufacturers.
Infineon Launches New Automotive Microcontroller Family
Infineon launched its new AUDO MAX family of 32-bit microcontrollers (MCUs) for automotive powertrain and chassis applications. The AUDO MAX family supports design of engine management systems meeting the strict Euro 5 and Euro 6 emission standards for combustion vehicles and enables the electrification of powertrain functions in electrical vehicles. Key features of the AUDO MAX family are maximum clock frequencies of up to 300MHz, high-speed in...
Aonix and SYSGO Team with Industry Consortium to Address Trusted Embedded Computing Issues
Aonix, the provider of the PERC product line for embedded and real-time Java developers and SYSGO, a leading supplier of software solutions for safety and security applications, announced their collaboration in the Trusted Embedded Computing initiative. Aonix will provide the PERC Ultra virtual machine and its expertise in security and complex embedded systems and SYSGO will provide PikeOS MILS compliant and safe and secure virtualization experti...
Boundary Scan Platform SCANFLEX accesses new Debug Interfaces for Processor Emulation Test
GOEPEL electronic introduces TIC020, another TAP Interface Card (TIC) within the frame of the JTAG/Boundary Scan hardware platform SCANFLEX. The new TIC module features a programmable multi bus interface, which enables a nearly unlimited compatibility to numerous standardised and proprietary test and debug protocols and, consequently, several thousand micro controllers.
Mitsubishi Electric and Infineon Technologies team up to serve the global power electronics industry
Infineon Technologies AG and Mitsubishi Electric Corporation, agreed to establish a service agreement by which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages SmartPACKs and SmartPIMs. This revolutionary package concept, recently developed by Infineon Technologies, will be available with the latest generation of power chip technologies from the two leaders.
RS Components launches Embedded Development Platform
RS Components has announced the launch of its Embedded Development Platform (EDP) designed to help deliver additional cost and time saving options to design engineers. This new solution consists of a baseboard able to hold a combination of up to four CPU or application modules, an innovation in this technology area. The EDP is RS’ first step in a process that will see the introduction of new processor and application modules on a regular basis...
European Research Project BioP@ss to Enhance Chip Card Security Paves the Way for Electronic ID Cards with EU-Wide Validity
Chip manufacturers Infineon Technologies AG and NXP Semiconductors Germany GmbH and chip card maker Giesecke & Devrient GmbH are among the eleven companies from six European Union countries participating in the European research project BioP@ss to develop a high-security chip card platform.