Search results for "STMicroelectronics"
SiC Maintains Growth Despite 2012 Power Electronics Downturn
Yole Développement announces its SiC Market 2013: Technology and Market for SiC Wafers, Devices and Power Modules report. Yole Développement’s report focused on the entire value-chain, covers all SiC applications in low, medium and high power ranges and provides all metrics up to 2020. It also includes a Bill-of-Material analysis, to compare Silicon vs. SiC-based system costs, and a cost reduction roadmap for SiC devices.
New Miniaturization Record by STMicroelectronics Makes More Room for Mobile Functionality
STMicroelectronics has introduced the world’s smallest TVS diode for protecting sensitive electronics in consumer products and handhelds. As the first such device to be offered in the industry’s smallest standard surface-mount outline of 0.45 x 0.2mm, the ESDAVLC6-1BV2 is one size smaller than today’s 0.6 x 0.3mm devices.
EEMBC and VOLKSWAGEN to Develop Benchmarking Standards to Quantify Microcontroller Energy Efficiency
The Embedded Microprocessor Benchmark Consortium (EEMBC) today announced an expanded working group project with the Volkswagen Group to establish an energy-efficiency benchmark for microcontrollers aimed at making automotive end products more energy aware and more robust.
STMicroelectronics Leads European Research to Secure Lead in Advanced MEMS Devices
STMicroelectronics has begun working with research partners to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging. The project was launched by the European Nanoelectronics Initiative Advisory Council Joint Undertaking, a public-private partnership in nanoelectronics.
ST Satellite-Tracking Chips Make A Mark On Europe’s Navigation System Roadmap
STMicroelectronics announce that its Teseo II single-chip satellite-tracking ICs were successful in the very first ground location test using Europe’s own independent navigation system, Galileo. The tests were conducted in collaboration with the European Space Agency. Last month, the first position fix of longitude, latitude and altitude using the four Galileo satellites currently in orbit was performed by the ESA at its Technology Centre in th...
STMicroelectronics Embraces New RF Front-End Standard
STMicroelectronics' STHVDAC-304MF3 antenna-tuning circuit has a 4-channel output for adjusting up to four tunable BST capacitors in the antenna-matching circuits of multi-band GSM/WCDMA/3G-LTE smartphones.
In-Silico VereFlu Lab-on-Chip Detects Current Avian Flu Subtype H7N9
Veredus Laboratories today announced that the current version of VereFlu detects the current subtype of H7N9 (Avian Flu) that is responsible for the Flu outbreak in China. H7N9 is the latest mutation to cause concern and increased surveillance in the region. Launched in 2008 and built on the STMicroelectronics lab-on-chip platform, VereFlu run on Veredus’ VerePLEX biosystem is the market’s first test to integrate two powerful molecular biolog...
STMicroelectronics Select Agilent 3-D EM Simulation Software To Develop Integrated Passive Devices
Agilent Technologies reveal that STMicroelectronics has selected Agilent's Electromagnetic Professional software for use in development of integrated passive devices. ST's Protection & IPAD business unit in Tours, France is handling the development. The use of IPD technology is a growing trend in the development of RF systems for mobile applications with a frequency range of 800 MHz and above.
Movea Teams up with STMicroelectronics to Recognize Advanced Gestures For a Better Home Entertainment Experience
Movea today announced its collaboration with STMicroelectronics on the integration of Movea’s SmartMotion Server with ST’s Orly set-top box system-on-chip, enabling the easy and rapid deployment of motion-based user interfaces for next-generation connected home systems.
STMicroelectronics Sign Loan Agreement With European Investment Bank
STMicroelectronics has put pen to paper a new Euro 350 million loan agreement with the European Investment Bank. The facility, which has not yet been drawn by ST, is also available in the US$ equivalent amount and has an option for disbursement until September 2014 with final maturity eight years after disbursement.