Search results for "Infineon"
electronica China and productronica China closed their gates with increasing figures
electronica China and productronica China welcomed 664 exhibitors from 19 countries in Shanghai. The number of exhibitors saw an increase of more than 38 percent compared to 2011. 41,847 visitors, 10 percent more than 2011, had a look on core technologies from renowned original leaders worldwide. The shows displayed the latest development of worldwide electronic industry and unveiled the future market opportunities.
Zero capacitor memory technology proved realisable on FinFET/TriGate device geometries
In a paper given by Innovative Silicon Inc. (ISi) at the recent IEEE SOI Conference, the company claims to prove the manufacturability of its Z-RAM (zero capacitor) embedded memory technology in FinFET and TriGate devices with geometries below 45nm.
Avago Technologies Closes Acquisition of Infineon's Fiber Business
Avago Technologies today announced that it has closed its acquisition of Infineon Technologies AG's Polymer Optical Fiber (POF) business unit based in Regensburg, Germany. This acquisition agreement between Avago and Infineon was jointly announced on April 2, 2007.
Mentor Graphics Teams with Infineon to Deploy State-of-the-Art Verification
Mentor Graphics announced it has successfully supported Infineon to improve Infineon’s verification productivity and effectiveness by assessing the status quo and by jointly establishing improved SystemVerilog (SV) methodologies. Mentor supported Infineon in this deployment based on Mentor’s functional verification solutions. The cornerstone of Infineon’s new verification environment is the Questa® functional verification platform. The tec...
CEA-Leti Workshop on Innovative Memory Technologies to Include Presentations by Samsung, Infineon, Micron, Macronix, STMicroelectronics
CEA-Leti organize its fourth workshop on innovative memory technologies at MINATEC on Thursday, June 21th, 2012.
German Research Project V3DIM Lays the Foundations in 3D Design for the Extremely High Frequency Millimeter-Wave Range
The “V3DIM” research project lays the foundations for working out the design requirements to develop innovative, highly integrated 3D System-in-Package (SiP) solutions for systems in the extremely high frequency range of 40 to 100 GHz, the so-called millimeter-wave range.
CSR collaborates with Infineon Technologies to integrate wireless connectivity onto mobile phone platforms
CSR today announced that it is collaborating with Infineon Technologies to pre-integrate its wireless connectivity platforms onto Infineon’s cellular reference designs. This new cooperation allows mobile phone OEMs to easily add connectivity functionality beyond Infineon’s existing product portfolio to their products. The pre-integration of the complete functionality into a reference design significantly reduces development costs and time to ...
Infineon AUDO MAX SHE Enhances In-Vehicle Security and Tamper-Proofs Electronic Control Units
Infineon Technologies AG now offers 32-bit microcontrollers of the AUDO MAX family with integrated security hardware. The new AUDO MAX SHE microcontrollers extend the tamper-proofing of electronic control units (ECU) and protect against tuning, for example. AUDO MAX SHE enables automotive manufacturers to ensure the integrity of their ECUs and to guard better against exposure to liability claims. Today three products of the AUDO MAX family come w...
Wind River and Infineon Expand Software Tools for TriCore Microcontrollers Used in Complex Automotive Applications
Wind River is collaborating with Infineon Technologies as part of a multi-year partnership to extend its integrated software tools portfolio by optimizing Wind River Diab Compiler for the TriCore microcontroller architecture of Infineon Technologies, including the latest AUDO MAX and future TriCore families.
Infineon Introduces Innovative New H-PSOF Packaging for Automotive Power Electronics; Sets New Standard for High-Current Capability and High Efficiency
Infineon Technologies today introduced an innovative package technology providing high-current capability and high efficiency for demanding automotive electronics applications, including electric and hybrid vehicles. The new TO package is compliant with JEDEC standard H-PSOF (Heatsink Plastic Small Outline Flat lead). The first available products using the H-PSOF package technology are 40V OptiMOS T2 power transistors offering up to 300A current ...