Search results for "infineon"

Micrel, Inc. today announced that Micrel’s High Bandwidth Marketing Director, Rami Kanama, has been promoted to the position of Vice President of Clock and Timing Products. Mr. Kanama will also serve as the president of the recently acquired PhaseLink Company Ltd, now a Micrel subsidiary. His promotion makes him a member of Micrel’s executive staff. Mr. Kanama will continue to oversee the marketing and business development of the High Band...

Infineon launched its new AUDO MAX family of 32-bit microcontrollers (MCUs) for automotive powertrain and chassis applications. The AUDO MAX family supports design of engine management systems meeting the strict Euro 5 and Euro 6 emission standards for combustion vehicles and enables the electrification of powertrain functions in electrical vehicles. Key features of the AUDO MAX family are maximum clock frequencies of up to 300MHz, high-speed in...

Infineon Technologies today announced it is the world’s first semiconductor provider of TPM (Trusted Platform Module) security chips that successfully passed most stringent security tests currently defined for PC security. The Trusted Computing Group (TCG), an impartial not-for-profit organization, confirmed that Infineon’s TPM is “TCG Certified”. The TCG certification is based on the international security standard “Common Criteria”...

Infineon Technologies and Mitsubishi Electric Corporation agreed to establish a service agreement by which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages SmartPACKs and SmartPIMs. This revolutionary package concept, recently developed by Infineon Technologies, will be available with the latest generation of power chip technologies from the two leaders.

The biggest research project in Europe to research and develop highly integrated electronic system-in-package solutions has been launched. Working together on the ESiP project (Efficient Silicon Multi-Chip System-in-Package Integration) are 40 microelectronics companies and research institutions from a total of nine European countries, with the aim of making miniaturized complex microelectronics systems more reliable and testable. Under the leade...

Infineon Technologies presents new IGBT modules designed for highest power density and reliability: a PrimePACK™ module with 1400A in 1700V in a PrimePACK 3 packaging, and the new flagship of the EconoDUAL™ family, the EconoDUAL 3 with 600A in 1200V.

At the Embedded World Show 2010 in Nuremberg, Infineon Technologies produced a complete and scalable high-temperature 8-bit microcontroller (MCU) family capable of operating at up to 150 °C ambient temperature, meeting the most rigorous industry standard for use in automotive and industrial electronics application environments. The new XC800 150°C family is specified without limitations for the temperature range from -40 °C up to 150 °C. This...

Infineon Technologies AG and Nokia today announced a cooperation to develop advanced radio frequency transceiver solutions. The agreement covers a non-exclusive collaboration to ensure the compatibility and interworking of Nokia’s advanced licensable baseband modem technologies and Infineon’s leading RF solutions.

Hitex Development Tools announces comprehensive support for the newly introduced XMC4000 family from Infineon Technologies. Frank Grobe, Managing Director at Hitex, said: “Infineon now combines for the first time its competence in application-optimized peripherals with an ARM Cortex-M4 core. As a development partner, we not only support the XMC4000 family with necessary tools, but also with consulting and the involvement of our partners”.

After the successful SafeTkit for TriCore awarded with the Embedded Award 2011, Hitex Development Tools now presents the SafeTkit for XC2000. The 16-bit SafeTkit XC2000 is a complete development package for designs based on Infineon’s XC2000 architecture. It contains all components enabling the developer to prepare his application for a quick and secure certification process according to IEC 61508 or ISO 26262.