Search results for "wire-to-board"

Providing a high current capacity of 6A at 350V, a low-profile, wire-to-board connector has been introduced by Hirose for high-power LED lighting applications. The DF59M series accommodates 22-28AWG wire and features a narrow 5.9x2.6mm (0.23x0.10") footprint and low profile that minimises LED light shadowing.

Claimed to deliver industry leading right angle connections with low applied cost, Molex's SolderRight direct solder terminals can now fulfil direct solder wire-to-board designs where a very low profile right angle solder option for wires exiting a PCB is necessary due to severe space constraints. Thisenables a secure and reliable connection with a minimal 'z' profile.

Enabling single point power delivery of 150, 200 and 300A in less than one linear inch of a PCB edge, the RadFin power connectors have been released by Amphenol Industrial Products Group. To meet the demand for high power PCBs with a small footprint, the connectors utilise RADSOK contact technology.

Combining small size and large current density, the Nano-Fit and Ultra-Fit power connectors have been released by Molex. These wire-to-board connectors are particularly suitable for consumer/home appliance, networking and telecommunications, industrial, and automotive/commercial vehicle applications.

Claimed to provide more flexibility than traditional power connectors, the Minitek Pwr Hybrid 3.0 and 4.2 connectors have been released by FCI. Alongside dual row power circuits, the 3.0 and 4.2 configurations are available for 2-24 power circuits and 2-12 signal circuits for wire-to-board applications. Crimping and removal tools are provided for wire harness assemblies, while vertical wave soldering headers are offered in through-hole configurat...

Expanding its Micro-MaTch connector family, TE Connectivity has announced the Micro-MaTch Value-line. These connectors feature a more economical design to help meet customers’ need for less demanding applications in industrial, consumer and datacomms industries.

At SPS IPC Drives 2014, which started today and finishes on 27th November in Nuremberg, Germany, TE Connectivity will unveil products for both factory automation and machine building applications.

Featuring a narrow 1.7mm pitch and 1.8mm mated height, the DF65 series wire-to-board connector has been hailed as the industry’s lowest-profile power connector by manufacturer Hirose. The connector provides high-current capacity and high reliability for power supplies, up to 4A (with 24 AWG wire) and 50V AC/DC.

FCI has announced the release of its robust Griplet miniature IDC connector for wire-to-board terminations. The low profile and compact design makes Griplet a suitable connector where space is tight and ease of installation is important. Each connector has a height of 3.7mm and a footprint of 4.0x6.1mm.

FCI has announced that it will exhibit its current range of connectors and launch several recently-introduced products at electronica 2014. FCI's booth will feature product highlights from various product categories, namely board-to-board, wire-to-board, power, terminal blocks, high speed backplane, high speed I/O, storage and FFCC/FPC. Live demonstrations will also be conducted throughout the exhibition.