Search results for "photon chips"
New sensor improves robotics
Lumotive and Hokuyo Automatic have announced the commercial release of the YLM-10LX 3D lidar sensor.
Opening a new nanoscale lane on the heat transfer highway
In the realm of heat transfer, thermal energy is conveyed by quantum particles known as phonons. However, at the nanoscale relevant to today's advanced semiconductors, phonons aren't sufficient for effective heat removal. Therefore, Purdue University researchers are exploring a novel approach by employing hybrid quasiparticles called ‘polaritons’ to enhance this process.
Top 5 IoT products in May
Electronic Specifier takes a look at the top 5 IoT products to have been released in May 2024.
Infineon receives building permit for Smart Power Fab in Dresden
Infineon is on schedule with the construction of the Smart Power Fab in Dresden and is initiating the final construction phase.
STMicroelectronics to build silicon carbide facility in Italy
STMicroelectronics announces a new high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania, Italy.
How to optimise asset tracking with Wi-Fi locationing
In the modern era it’s reasonable to assume that expensive items moving around the world are carefully tracked and protected and therefore never go astray. But no, there are still a disturbing number of mishaps resulting in key assets disappearing – sometimes forever.
Major imaging challenges in microscopy and how to solve them
Microscopic cameras play a major role in medical applications for surgery, pathology, and diagnostics.
Weebit Nano and Efabless enable affordable SoC prototyping
Weebit Nano, a leading developer and licensor of advanced memory technologies for the global semiconductor industry, and Efabless, the creator platform for chips, announce their collaboration to enable fast and easy prototyping of intelligent devices using Weebit’s technology.
Flip-chip die bonder from ITEC
ITEC has introduced the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines, attaching up to 60,000 flip-chip dies per hour.
New survey to assess high-demand job skills in microelectronics
SEMI invites key industry stakeholders to participate in a survey designed to assess job skills in highest demand in Europe's microelectronics industry in 2024.