Search results for "Master Bond"
Crystal oscillators suit hi-rel applications
Euroquartz has introduced a new range of crystal oscillators from Statek offering tight frequency stability for use in a wide range of high-reliability applications.
90% of women see AI as key, but only 35% feel prepared
Ninety per cent ofwomen viewgenerativeAI as a crucial elementin their professional advancement, according to a recent report by Nasscom and Boston Consulting Group.
BAE Systems' apprenticeships: cultivating talent, boosting industry
BAE Systems, a pioneer in thedefence, aerospace, and securitysector, has long been committed to nurturing talent through itsapprenticeship programmes.
Researchers demonstrate viability of 3D printed concrete
A research team at the University of Virginia School of Engineering and Applied Science has explored how cellulose nanofibrils, a novel plant-based material, can enhance the benefits of 3D-printed concrete technology.
Pushing organic semiconductors even further
Physicists at The Cavendish Laboratory have discovered two new methods that allow further enhancements of organic semiconductors.
Series 15 – Episode 7 – Enabling rapid photonic integrated circuit development
Paige West speaks with James Lee, CEO/Co-Founder, Wave Photonics, about photonic integrated circuits and the company’s overall mission.
How adhesive providers can empower electronics engineers
Electronicsare an increasingly fundamental part of everyday life, which means the systems and products that make them possible must be reliable, long-lasting, and fit for purpose.
binder launches new M8 12-pin circular connector
binder has launched a new M8 12-pin circular connector, designed primarily for demanding industrial applications.
BioOrbit: creating medicine that’s out of this world
In the infinite and often intangible fathoms of the cosmos, one company is looking to the stars – or more specifically, Low Earth Orbit – to build a pharmaceutical factory in space that will create crystalline antibodies to help those on earth.
ASMPT and IBM advance bonding for AI Chiplet packages
ASMPT and IBM have announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.