Search results for "infineon"

Dialog Semiconductor, a provider of power management semiconductor solutions has announced a strengthening of its senior management team with the appointment of Mark Tyndall as Vice President - Business Development and Corporate Strategy.

Fairchild Semiconductor and Infineon Technologies, today announced a packaging partnership for their power MOSFETs in the MLP 3x3 (Power33™ or S3O8) and PowerStage 3x3 packages. The compatibility agreement is in response to the need for supply security while balancing the drive towards best-in-class efficiency and thermal performance in DC-DC conversion. It takes advantage of the expertise both companies offer for asymmetric, dual and single MO...

Test solutions specialist A.T.E. Solutions has been appointed as exclusive UK representative for Algocraft and its WriteNow! In-System Programming (ISP) products. Under the appointment A.T.E. Solutions will provide technical support for Algocraft’s products and be able to integrate the ISP capability into its custom test solutions.

Andi Guan talks about the impact of smart grids on electricity costs and the future role of consumers.

Yole Développement's FOWLP Patent Analysis is now available. Fan-Out Wafer Level Packaging is the most innovative advanced packaging technology today, adopted for mobile phone and consumer electronics applications. After several years of specific analysis for customers, Yole Développement has decided to publish its first analysis of the technical contents of patents.

Yole Développement has today released a new report on the 'Status of the Power Electronics Industry'. In this report, Yole Développement highlights the trends of disruptive power semiconductors technology and market.

Atollic today announced the addition of target support for NXP’s family of ARM Cortex-M0 and Cortex-M3-based microcontrollers in its award-winning Atollic TrueSTUDIO for ARM C/C++ development environment.

Future World Symposium debate determines challenges and technology drivers for automotive sector innovation

Infineon Technologies AG and Fairchild Semiconductor Corp. today announced a licensing agreement on Infineon’s advanced automotive MOSFET packaging technology H-PSOF (Heatsink Plastic Small Outline Flat Lead), a JEDEC standard TO-Leadless package (MO-299).

Giving the medium-sized and compact car category access to the safety and convenience applications of the premium segment and enabling their compliance with the strictest fuel consumption and pollutant emission requirements, Infineon Technologies AG today announced the cost-optimized extension of its successful XC2000 automotive microcontroller portfolio. Enabling 32-bit equivalent performance at 8-bit costs the new 16-bit devices address low-end...