Search results for "Master Bond"
Power modules provide solution for vehicle on-board charging
A driver of energy efficient innovations, ON Semiconductor has launched new Automotive Intelligent Power Modules (IPMs) that offer good power density and improve overall performance in on-board charging (OBC) and other high-voltage DC/DC conversion applications for electric vehicles (EVs) and plug-in hybrid electric vehicles (PHEVs).
High-calibre knowledge for the embedded world
The embedded world is developing brilliantly, the prospects are good for the embedded world Conference and the electronic displays Conference, the programs of which are already available. The motto for this year’s embedded world Conference is ‘Embedded Intelligence’, focusing on a central issue in the industry. The electronic displays Conference deals with the latest topics relating to OLEDs and touchscreens.
Absolute positioning with just one sensor
A new generation of positioning systems have been developed by Pepperl+Fuchs that-for the very first time-achieve SIL 3/PLe compliance with a single sensor, making them safe and highly efficient. While previously associated with high cost and time investment, this safety level can now be attained more simply than ever before.
Epoxy for bonding composite substrates
Techsil has developed a new clear, epoxy adhesive called EP25880 Clear that provides a bond on carbon fibre composite parts.Techsil’s Application Engineer Steve Green explained: “I have been working with a number of companies that were manufacturing and assembling products made of composite materials and a need arose to find a product that could bond carbon fibre parts quickly and neatly. There are expensive adhesives on the market bu...
Protecting vehicles against explosive device threats
The military-grade polyurea protective coating designed to provide superior protection from explosions, PAXCON, has been announced by LINE-X, a division of IXS Coatings. PAXCON was recently put through extensive blast-testing equivalent to a car bomb explosion and reportedly proved itself as an effective solution for maintaining structural integrity and reducing the effects of debris following a high-powered explosive detonation.v
At the centre of Industry 4.0
The joint PI (PROFIBUS & PROFINET International) stand at the SPS IPC Drives trade fair in Nuremberg, Germany taking place from the 27th to 29thNovember2018 will be located in Hall 5 / Stand 210, and will form a fundamental bridge between automation and IT.
High tensile epoxy adhesive utilises renewable biomaterial
Master Bond EP70CN is a two part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This epoxy system forms high physical strength bonds and can be utilised for bonding, sealing, coating and potting.
Development solution for software debugging over XCP protocol
Vector and Lauterbach are offering an integrated solution for ECU software development based on the new ASAM standard 'Software Debugging over XCP'. It eliminates the need to repeatedly switch between hardware for measurement, calibration, and debugging.
It is High Time for IR Sensor 2.0 – And This Is Why
The IR sensor is a crucial component in many everyday products, ranging from medical equipment to mobile phones. But the technology is 50 years old and in serious need of an upgrade. The next generation IR sensor 2.0 for IoT will be much thinner than old sensors and cheaper to manufacture.
Integrated keyboard for ten inch rugged tablet
Developer and manufacturer of reliable computers for demanding environments, JLT Mobile Computers, has announced an expansion of its tablet lineup with two new products that will help customers improve productivity. A new high-performance version of the rugged MT2010 tablet provides processing power for the most demanding software applications.