Search results for "ASIC"
Structured ASIC Family with Embedded IP
The CX6000 family of Structured ASICs from ChipX is fabricated in a high performance, eight-metal 0.13-µm process, and is said tothe accelerate time-to-market and reduces risk by integrating silicon proven IP subsystems into the Structured ASIC fabric.
ChipX's CX6200 family is placed on the USB-IF Integrators list.
ChipX, the Structured ASIC leader, today announced that the CX6200 family of Structured ASIC products has passed the stringent USB Implementers Forum compliance test, and is placed on the USB-IF Integrators list.
Aniotek Selects ChipX Structured ASIC for Fieldbus Controller
ChipX has announced an ongoing relationship for deploying Aniotek’s critical UFC100-F1 Fieldbus Controller in an easy to use Structured ASIC platform. Aniotek selected the ideal slice from ChipX’s CX3000 family of Structured ASICs supporting 3V and 5V I/O for this application. The UFC100-F1 is a pin- and software-compatible alternative to the Yamaha YTZ420 chip that offers improved jitter tolerance and a larger first-in/first-out (FIFO) mem...
ChipX XPath Methodology Enables Seamless Migration from Structured ASIC to Standard Cell
ChipX Inc. today announced a new methodology that enables customers to launch their products quickly with a Structured ASIC and then seamlessly migrate their design to a Standard Cell device once the product features and market potential have been validated. The methodology, called XPath, enables customers to get products to market quickly and inexpensively and will play a valued role in the production of ASICs for a wide variety of applications...
ChipX appoints Michael Brown as VP of Worldwide Sales
ChipX announced today that Michael Brown has joined the company as Vice President of Worldwide Sales. In this position, Brown will be responsible for driving, growing and managing ChipX’s Worldwide Sales and Customer Service organizations. He will report to the CEO, Amnon Fisher.
Innovative Silicon Names Paul Pickering VP of Worldwide Sales
Innovative Silicon (ISi), the developer of Z-RAM ultra-dense memory intellectual property, announced today the appointment of Paul Pickering to vice-president of worldwide sales. Reporting to ISi CEO, Mark-Eric Jones, Pickering brings to ISi a strong sales background from market-leading semiconductor companies such as Fairchild, Toshiba, LSI Logic and PMC-Sierra.
Autorouter and layout device generator from Tanner EDA speeds up analogue and mixed-signal ASIC design
EDA Solutions has announced the availability of version 14.0 of Tanner EDA’s Tanner Tools Pro and HiPer Silicon design software, including a new interactive autorouter, SDL Router, and a layout device generator, DevGen. Both these additions increase designers’ productivity and speed up development of full custom analogue IC and MEMS design.
EDA Solutions and Europractice host mixed-signal ASIC design training course
EDA Solutions and Europractice will be running a practical training course on Europractice Design Kits for the latest Tanner IC Design Tools. The two day course will be held in four European locations this Autumn and will cover various aspects of mixed-signal ASIC design.
Chelsio Communications Licences Tensilica’s Xtensa LX Customizable Dataplane Processor Core For 10 Gigabit Ethernet
Tensilica, Inc. today announced that Chelsio Communications, Inc., of Sunnyvale, Calif., has licensed the Xtensa LX customizable DPU (dataplane processor) for its next-generation 10Gb Ethernet Terminator ASIC (application specific integrated circuit). Chelsio has used Tensilica's Xtensa DPUs in two previous generations of Terminator ASICs.
Tensilica's Diamond Standard 330HiFi Audio DSP Licensed by Fujitsu
Tensilica has announced that its Diamond Standard 330HiFi Audio DSP (digital signal processor) has been licensed by Fujitsu Microelectronics Limited for use in a customer's portable consumer electronics design.