Search results for "soldering"
Aluminum electrolytic capacitors: Rugged versions with higher ripple current capability
TDK Corporation presents a new series of rugged EPCOS axial-lead aluminum electrolytic capacitors for automotive electronics. These components are distinguished by their very high ripple current capability and vibration resistance. Thanks to the very low ESR values and a further reduction in internal thermal resistance, the self-heating of the new B41689* series is significantly lower. This allows the ripple current capability to be increased by ...
New Development Board For Cypress PSoC 3 And PSoC 5LP Architectures
SchmartBoard has expanded its product offering with a new development board to support users of PSoC programmable system-on-chip architectures from Cypress Semiconductor. The board uses SchmartBoard’s EZ soldering technology to assure fast, easy and flawless soldering of PSoC 3 or PSoC 5LP silicon onto the board, or users can purchase one fully populated with boot-loaded PSoC silicon.
Stamped Spring Pin Socket for Hittite's HMC7271
Ironwood Electronics recently introduced a new LGA socket addressing high performance requirements for 0.5mm pitch devices - CBT-LGA-5000. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 500,000 insertions.
8 GHz Epoxy Mount Socket for DDR3 Memory Packages
Ironwood Electronics has recently introduced a new high performance BGA socket for 0.8mm pitch BGA 78 pin DDR3 packages. The SG-BGA-6374 socket is designed for an 9x13 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss.
40 GHz Bandwidth Lever Lid Socket for Synopsys's BGA1156
Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 40 GHz, very low inductance, high endurance and wide temperature applications. The SM-BGA-9032 socket is designed for 35x35 mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss.
New Design Options For HARTING har-flex Connectors
HARTING has introduced a number of new devices in its har-flex family of compact, versatile and rugged board-to-board and board-to-cable 1.27 mm pitch connectors. Straight and angled connectors are now available as PCB models which, when combined with the connectors for flat ribbon connection, allow PCBs to be combined into complex systems perfectly adapted to their surroundings.
Vishay Intertechnology Introduces New High-Speed 850 nm and 940 nm IR Emitters and Package-Matched High-Speed Silicon PIN Photodiode for Infrared Touch Panels
Vishay Intertechnology Inc today broadens its optoelectronics portfolio with the introduction of two new high-speed 850 nm and 940 nm infrared emitters and a package-matched high-speed silicon PIN photodiode with high radiant sensitivity from 780 nm to 1050 nm. The VSMG10850, VSMB10940 and VEMD10940F offer an ultra-wide ± 75° angle of half intensity in a compact side-view surface-mount package measuring 3 mm by 2 mm and a height of only 1 mm.
Going To Extremes
How do sensitive electronic devices survive the increasingly hostile environments experienced by downhole drilling equipment? Sally Ward-Foxton investigates in this article from ES Design magazine.
AIM Solder Announces the Release of NC277 VOC-free Liquid Flux
AIM Solder announces that NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux and has a medium residue that is suitable for long thermal demands. Winner of a 2013 NPI Award from Circuits Assembly, this halide-free, environmentally safe liquid flux has upon introduction been recognized for exceeding industry standards.
Ericsson Surface-Mount Advanced Bus Converter Saves Board Space
Ericsson Power Modules have today announced the introduction of a new surface-mount DC-DC converter module. The BMR456-SI is based upon the FRIDA II platform, which was announced last year, both the surface-mount BMR456-SI and the through-hole BMR456-PI quarter-brick 3E* Advanced Bus Converters deliver unprecedented performance to system architects that are developing equipment for ICT applications.