Search results for "infineon"

Infineon Technologies today introduced a new transceiver family that simplifies system design and production logistics by replacing more than 10 discrete devices. Due to their low power consumption the single-chip high-integration transceivers also help to reduce fixed expenses in high data rate millimeter wave wireless backhaul communication systems.

The breadth of applications now covered by 32bit devices means IDMs are extending their reach in both directions, to make sure all use-cases are covered, as Philip Ling, Editor of ES Design magazine discovers.

Yole Développement announces its SiC Market 2013: Technology and Market for SiC Wafers, Devices and Power Modules report. Yole Développement’s report focused on the entire value-chain, covers all SiC applications in low, medium and high power ranges and provides all metrics up to 2020. It also includes a Bill-of-Material analysis, to compare Silicon vs. SiC-based system costs, and a cost reduction roadmap for SiC devices.

The Embedded Microprocessor Benchmark Consortium (EEMBC) today announced an expanded working group project with the Volkswagen Group to establish an energy-efficiency benchmark for microcontrollers aimed at making automotive end products more energy aware and more robust.

Infineon Technologies was selected by Visa as a preferred supplier of security controllers for new GlobalPlatform compliant payment cards issued in the Latin America and Caribbean region. Infineon will supply its SOLID FLASH security controllers for both contact-based as well as Dual Interface debit and credit cards including VISA approved Visa Smart Debit Credit applets. Infineon supports the payment industry with the latest VSDC applets to prov...

According to analysis by Semicast Research, Infineon was the leading vendor of semiconductors to the industrial sector in 2012, although its lead over second placed Texas Instruments was cut to just a few tenths of a percentage point. Both companies maintained a clear lead over the next largest vendors, STMicroelectronics and Renesas Electronics, with Analog Devices completing the top five. Semicast calculates that revenues for industrial semicon...

STMicroelectronics has introduced the first MDmesh V Super-Junction MOSFET featuring a new package technology that increases the efficiency of power circuitry in equipment such as white goods, televisions, PCs, telecom, and server switched-mode power supplies.

Researchers at Tyndall National Institute at UCC in Cork, Ireland are leading an international project in advanced nanoelectronics which is aimed at maintaining Europe's position as a world leader in innovative automotive power electronic systems for both conventional and electric cars.

Two years ago, Yole Développement said “The SiC industry is not a niche market anymore.” With its SiC technology & market analysis update arriving in May 2013, the French technology consulting company will confirm this statement by announcing that the SiC Devices market will surpass US$600M by 2020. “We expect a SiC market with 30% CAGR between 2015 – 2020,” said Dr. Philippe Roussel, Business Unit Manager, Power Electronics & Compound...

Infineon Technologies AG introduced DrBlade – the first integrated DC/DC driver and MOSFET VR power stage implemented in an innovative chip-embedded package technology. DrBlade contains the latest generation low voltage DC/DC driver technology and OptiMOS MOSFET devices.