Search results for "Master Bond"
Two component epoxy with thermal shock resistance
Master Bond EP110F8-3 is a two part epoxy system ideal for sealing, encapsulating, potting, and casting applications. “This toughened system provides very good flexibility and possesses a relatively high elongation of 120-150%”, said Rohit Ramnath, Senior Product Engineer. “It offers a low tensile modulus of around 5,000-15,000 psi and a shore A hardness of 40-50 at room temperature."
Power modules deliver efficient, space saving solutions
Innovator in energy efficiency, ON Semiconductor, has launched new Power Modules that offer energy efficiency, reliability and performance in highly integrated and compact packaging, adding to the company’s portfolio of power semiconductor devices.
New AI app successfully decreases symptoms of COPD
A peer-reviewed clinical study, published in the International Journal of Chronic Obstructive Pulmonary Disease (COPD), has shown to successfully reduce symptoms of the disease using a new Artificial Intelligence (AI) app, developed by digital therapeutics company Kaia Health.
Automotive industry driving SiC power device ramp-up
On November 12th, it was announced by Infineon it will acquire Siltectra. Infineon is a well-known semiconductor player and according to Yole Développement (Yole), it is the current leading power electronic device company. But Siltectra is much less well known. Here, Yole explains this acquisition.
Competition to win 100 AVR-IoT WG development boards
Online electronics maker community, Electromaker.io, has announced a project-based competition for hobbyists with 100 Microchip AVR-IoT WG Development boards as prizes, Entrants will also win the chance to compete for a place at the 2019 Microchip Masters conference in Berlin.
Tektronix Launches Certified Amazon Package Testing Service
Tektronix has received certification to provide ISTA 6-Amazon.com package testing for products being sold on Amazon.com. Certified package testing from Tektronix helps manufacturers reduce overall packaging costs, minimize shipping damage, and delight their customers with intuitive and easy-to-remove packaging.
mmWave sensor integrates MCU and hardware accelerator
The IWR1443 device is an integrated single-chip mmWave sensor based on FMCW radar technology capable of operation in the 76- to 81GHz band with up to 4GHz continuous chirp. The device is built with TI’s low power 45nm RFCMOS process, and this solution enables unprecedented levels of integration in an extremely small form factor.
The future of artificial intelligence
Reviewing industry analyst and media pundit predictions confirms that many expected 2017 to be a significant year for artificial intelligence (AI). Forbes, Deloitte, Gartner, Accenture, Digital Trends and TechRadar all concurred, listing AI and machine learning among tech trends to watch in 2017. By Mark Patrick, Mouser Electronics
Digital tiles turn bedroom walls into cinema screens
A team of European scientists have developed a set of digital, ceramic tiles that can change colour, pattern, or play videos with a connected smartphone or tablet, turning a bedroom wall or ceiling into a giant cinema screen.
Media converter targets automotive Ethernet
Automotive Ethernet is a standardised interface in the automotive industry and an important component of future vehicle architectures. GOEPEL electronic has now developed the second generation of the EasyCON media converter. It physically converts a standard Ethernet layer to Automotive Ethernet 1000/100 Base-T1.