Search results for "soldering"
Nihon Superior will appear at NEPCON to address Soldering challenges
Nihon Superior will showcase in Stand 2B20 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, including lead-free die attach, void minimization, environmental protection, and process yields.
10GBASE-T press-fit ICM from Pulse Electronics
Pulse Electronics has today announced the new 10GBASE-T press-fit integrated connector module product family. These 10 gigabit press-fit RJ45 ICMs meet IEEE 802.3 specifications and are available in common industry configurations: 2x2, 2x4, 2x6 and 2x8. The Pulse Electronics ICMs facilitate the implementation of 10GBASE-T in large enterprises and cloud data centers.
Vishay low profile 10 mm SMD 7-segment LED displays
Vishay Intertechnology have today announced the introduction of two new series of 10 mm standard surface-mount 7-segment LED displays in compact, low-profile packages. Utilizing AllnGaP on GaAs chip technology for high luminous intensity to 2750 µcd typical, the VDMx10x0 and VDMx10A1 series displays are offered in super red, soft orange, yellow, and green for a wide range of applications.
Everyone’s an individual
How a new approach to the single-strand wiring of PCBs addresses existing challenges by offering a powerful, reliable, economical and easily installable interconnection solution. Kevin Canham, Production and Application Manager with Harting Technology Group, explores more in this article from ES Design magazine.
Combinable ring light series
Vision & Control presents its three new coaxial ring lighting series RK2036, RK3652 and RK5268, which can all be combined. The diameters of the ring lights are compatible, allowing the three different sizes in the series to fit together.
New pressure sensor technology from STMicroelectronics
STMicroelectronics introduce a new patented technology that isolates the pressure-sensing element within a fully molded package. This allows designers to meet the ultra-small form factor requirements and design creativity for the next generation portable consumer devices. The new ST technology enhances accuracy (± 0.2 mbar) while continuing to offer zero drift, low noise (0.010 mbar RMS) and a simplified calibration system.
Allegro launch new POL converter modules
Allegro Microsystems has today introduced a new series of POL converter modules, the BR200 series. Featuring an industry standard exterior shape and footprint, these new thin-profile POL converters are responsive to very high speed loads and are also compatible with ceramic capacitors. Typical applications for the BR200 series include router switch equipment and WDM computer server applications within the telecommunication server market.
SCHURTER introduces UMF 250 compact SMD fuse
SCHURTER has today announced an expansion of its successful UMF 250 SMD fuse series with nine additional rated currents. With this extension, the series is now complete with rated currents ranging from 500 mA to 10 A. The compact, quick-acting SMD fuse thus provides overcurrent and short circuit protection for an even wider range of applications.
Surface-mount photodiodes with 35° angle of half sensitivity
Vishay Intertechnology has broadened its optoelectronics portfolio with the introduction of new high-speed photo detectors in miniature gullwing, reverse gullwing, and side-view packages with wide-view dome lenses. Offered with or without daylight blocking filters, featuring a ± 35° angle of half sensitivity, and AEC-Q101-qualified, the VEMD2xx3(SL) PIN photodiodes have a typical output current of 10 µA and an extremely low dark ...
DSM launch the Stanyl ForTii
DSM explains that its Stanyl ForTii is the only halogen free, high temperature polyamide that answers the stringent requirements of reflow soldering for DDR3sockets, as well as the demand for high flow. It also offers extremely low warpage after reflow. The DDR3 is a well-established and mainstream interface technology for computer random access memory modules. The modules can transfer data at speeds of between 800 and 1600Mbps and operating freq...