Search results for "Master Bond"
Development platform delivers custom solutions
The first customer shipment of a new 130nm manufacturing process node based FFSA (Fit Fast Structured Array) development platform, has been announced by Toshiba Electronics Europe (Toshiba). This innovative high performance System-on-Chip (SoC) development platform delivers custom solutions that feature low power consumption at a low cost point.
Driving GaN-on-Silicon monolithic microLED technology for AR
Developer of optoelectronic technology solutions, Plessey, is collaborating with EV Group (EVG), a supplier of wafer bonding and lithography equipment, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market. microLEDs are a key optical technology for next-generation AR applications.
Designing technology for the elderly
While many older Americans use technology, it’s rarely designed with them in mind.
The cognitive business disruption
Cognitive systems may bring to mind artificial intelligence’s dark side, one propelled by visions of robots coming to rule over humans like they do in popular sci-fi films such as The Terminator, Ex Machina, and Transformers.
From idea to real prototype in a fast, flexible and lean way
The automotive industry request sensor prototypes to test new algorithms and application possibilities in the early stage of their design. For this reason, Infineon developed a new methodology, allowing a smooth transition from idea to implementation. By Simone Fontanesi, Gaetono Formato, Andrea Monterastelli, Infineon Technologies
‘Safe for the Future’ at embedded world 2019
Following the success of the event in the last three years, the panel discussion on 27th February, the second day of the embedded world Exhibition & Conference 2019, will enter its fourth round. Under the theme ‘Safe for the Future’, Exhibition Centre Nuremberg will once cover all aspects of the safety and security of embedded systems and the protection of computers and communication channels.
Extending global reach
The fume and dust extraction technology manufactured by Poole-based BOFA International is now available in Canada through Coding Products of Canada.BOFA has announced that Coding Products of Canada has been awarded Platinum status as a Master Distributor for Canada. As such, the company is now authorised to stock, supply, warranty and service all BOFA products in Canada.
Custom LCD platform slashes product development time
SimplePlus a platform that simplifies the process of customising LCD touch display solutions has been released globally by Avnet. It covers applications spanning markets which include industrial automation, medical and transportation. The platform can shorten product development cycles by delivering customers their first working unit within 48 hours, instead of the typical weeks or months for traditional samples.
Software Programmability and Scalable AI Inference all in one
Enabling a new era of rapid innovation for any application by any developer, Xilinx, Inc. CEO Victor Peng unveiled Versal – the industry's first adaptive compute acceleration platform (ACAP). Versal ACAPs combine Scalar Processing Engines, Adaptable Hardware Engines, and Intelligent Engines with leading-edge memory and interfacing technologies to deliver powerful heterogeneous acceleration for any application.
Stack FinFETS with 45nm fin pitch using sequential 3D integration
At the IEEE IEDM 2018 conference, imec, the research and innovation hub in nanoelectronics and digital technologies, presented a demonstration of 3D stacked FinFETs on 300mm wafers using a sequential integration approach with a 45nm fin pitch and 110nm poly pitch technology.