Search results for "Infineon"

Infineon Technologies today introduced a family of 3D Image Sensor chips for implementation of touchless gesture recognition. Developed in cooperation with pmdtechnologies, the new chips are the first to combine a 3D image sensing pixel array with the digital conversion and control functionality needed to design very compact and accurate monocular systems for gesture recognition applications in computers and consumer electronics devices.

Infineon Technologiesannounced that it is supplying security chips to Taiwan’s electronic passport program. Infineon is the only supplier and has started shipping security chips of the SLE78 product family based on the digital security technology “Integrity Guard”.

Infineon Technologies has introduced BGA825L6S, a highly cost-effective Low Noise Amplifier for Global Navigation Satellite Systems. It features an ultra-low noise figure, high linearity, high gain and low current consumption over a wide range of supply voltages from 3.6V down to 1.5V.

Infineon Technologies today introduced its next generation of high-voltage IGBT gate drivers. Designed for the main inverter of hybrid and electric vehicles (HEV), the new EiceDRIVER SIL and the EiceDRIVER Boost drivers enable automotive system suppliers to more easily and more cost-effectively design HEV drivetrain subsystems that are compliant with ASIL C/D functional safety requirements (ISO 26262). Target applications of the new EiceDRIVERs a...

SEGGER has added support for Infineon’s Single Pin Debug Interface for the XMC1000-series of Infineon Technologies to the J-Link family of debug probes. The J-Link is the only commercial debug probe in the market capable of connecting to a device with the SPD-interface.

Yole Développement and TRANSDUCERS 2013 Organizing Committee have joined forces to develop the most powerful event dedicated to the MEMS technology. This event takes place next week, in Barcelona, Spain.

At PCIM Europe 2013 in Nuremberg (May 14-16, 2013), Infineon Technologies AG launches its new EconoDUAL 3 IGBT modules, which are fully qualified according to automotive standards. The new offering addresses demanding applications in commercial, construction or agricultural vehicles where extended reliability is a key. Automotive qualification means that the modules provide significantly increased thermal cycling and thermal shock capability, whi...

Infineon Technologies highlights its 650V TRENCHSTOP 5 at the PCIM Europe 2013 in Nuremberg. Since the introduction of this next generation thin wafer IGBT (Insulated Gate Bipolar Transistor) in the autumn of 2012, the TRENCHSTOP 5 has attained strong market attention and is recognized as a game changing technology.

Innovations in design are helping automotive manufacturers to simplify systems and reduce component count, by implementing more functions while reducing board space requirements and power consumption. By Thomas Mueller, Product Manager, Automotive ASICs with ams AG.

Infineon Technologies introduce the new TO-Leadless package offering reduced package resistance, significantly smaller size as well as improved EMI behaviour. It contains the latest OptiMOS MOSFET generation for applications with high power and reliability requirements such as forklift, light electric vehicles, eFuse, Point of Load and telecom systems.