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New compact RT launched by Seica SpA
Seica has responded to the ongoing market trend of miniaturisation of electronic printed circuit boards by launching the new compact RT NEXT> SERIES, a fully automatic rotary table based system ideal for medium/high volume production.
TR Fastenings to exhibit at Advanced Engineering Show 2023
TR Fastenings are celebrating their 50th year in fasteners. TR has experienced the changing world of fasteners over that period with the advancements in plastics, composites, and the use of more exotic materials.
Schematic capture software for electronics engineers
Schematic capture software is an indispensable tool for engineers engaged in the creation of electronic circuits and systems.
Qt features LG’s advanced automotive content platform
Qt and LG are joining forces to embed the Qt software framework for application development in LG’s webOS based ACPLG’s in-vehicle entertainment platform. This collaborative effort aims to empower automotive OEM developers and designers to create more innovative, immersive content-streaming services for cars.
Mouser recognised with two awards
Mouser Electronics has announced it has received two significant distribution awards from Vishay Intertechnology, a partner and manufacturer of electronic components.
Ultra-low capacitance ESD protection diodes protect automotive data interfaces
Nexperia announced an extension to its portfolio of ultra-low capacitance ESD protection diodes designed to protect high-speed data lines in interfaces such as USB, HDMI, high-speed video links and Ethernet in automotive infotainment applications.
X-FAB enhances automotive-grade high-voltage CMOS foundry
X-FAB has updated its XP018 high-voltage CMOS semiconductor fabrication platform with new 40V and 60V high-voltage primitive devices, which feature an extended SOA for improved operational robustness.
Professor resolves two decades of oxide semiconductor challenges
In a significant stride for semiconductor technology, a team led by Professor Yong-Young Noh from the Department of Chemical Engineering at Pohang University of Science and Technology (POSTECH) has developed a new tellurium-selenium composite oxide semiconductor material.
800G OSFP transceiver enters volume production
LESSENGERS, a supplier of optical components based on its patented “direct optical wiring” (DOW) technology, says its new 800G transceiver product (800G OSFP SR8) will begin volume production in the Q4 2023, followed by shipping to customers.
Taiwan Semiconductor’s ThinDPAK Schottkys deliver power density upgrades
Taiwan Semiconductor, a global supplier of discrete power electronics devices, LED drivers, analog ICs, and ESD protection devices, announces its new ThinDPAK family of fast-recovery Schottky rectifiers.