Search results for "nordic semiconductor"

Infineon is introducing the HybridPACK Drive G2 Fusion, establishing a new power module standard for traction inverters in the e-mobility sector.

Lauterbach and Kernkonzept enable architects of virtualised software systems to start development and testing on future RISC-V platforms even before corresponding System-on-Chips (SoCs) are available in silicon.

PEMTRON has announced its participation in SEMICON Europa, taking place from 12-15 November 2024 at Messe München in Munich, Germany.

Navitas has announced GaNSlim, a new generation of highly-integrated GaN power ICs that will further simplify and speed the development of small form factor, high-power-density applications by offering the highest level of integration and thermal performance.

Enabled by semiconductor technology, vehicle-to-grid (V2G) bidirectional charging can provide battery power to reinforce electric grids during peak demand and power your home when electricity is expensive or out.

Infineon hosted its first-ever Supplier Sustainability Summit to further stimulate collaboration and incentivise and support suppliers to accelerate their decarbonisation journeys. The virtual event brought together about 100 top semiconductor industry suppliers.

ROHMhas developed external FET-type controller ICs utilising PWM current control mode optimised for AC/DC power supply in various industrial applications. Mass production has begun for four variants designed to drive a wide range of power semiconductors: theBD28C55FJ-LBfor low-voltage MOSFETs,BD28C54FJ-LBfor medium- to high-voltage MOSFETs,BD28C57LFJ-LBfor IGBTs, andBD28C57HFJ-LBfor SiC MOSFETs.

Themed‘Innovation and Collaboration: Powering Sustainable Exponential Growth’,SEMICON Europa2024will gather industry experts 12–15 November 2024 at Messe München in Munich, Germany for insights into the latest innovations and trends in sustainability, mobility, healthcare, materials, packaging, fab management, and workforce.

Keeping electronics cool - or, rather, the challenge of keeping electronics cool - is being investigated by researchers at Purdue University, as the heat generated by consumer electronics from smartphones to laptops and computers, eventually leads to the deterioration of the device.

At an exclusive event in Ann Arbor, Michigan, the Automotive Chiplet Forum 2024 brought together key players in the global automotive ecosystem to discuss the shift towards chiplets in vehicles.