Search results for "nexperia"

Under normal circumstances everyone in the industry should be in the process of clearing their diary and packing the lederhosen as the great and the good of the electronics world descend on Munich for the biennial electronica exhibition.

Nexperia hasannounced ‘Power Live’, a virtual conference that will take place on 2nd-3rdJuly, and will cover a wide range of subjects related to power electronics including GaN devices, Silicon Germanium (SiGe) rectifiers, automotive applications and packaging technology.

Farnell is now stocking Nexperia’s innovative Power Gallium Nitride (GaN) FET range.

JoinNexperia’sPower Live Event and watch our resident power experts present a series of on-demand demonstration videos acrossa number oftopics in Automotive, Industrial,GaNand Power packaging.IncludingGaNsurface mount package technology and novel Silicon-Germanium rectifiers.Engage with like-minded people in live sessions to discuss common challenges and demands.Pre-register and getyour free tickethere.

As gate drivers are now capable of efficiently meeting large Qg requirements and faster switching topologies create smaller, more efficient systems, some often ignored parameters have now become system-critical.

Nexperia has announced a wide portfolio of automotive-qualified AEC-Q101 discretes in space-saving, thermally-efficient, AOI-compatible DFN (Discrete Flat No leads) packages. The AEC-Q101 range of devices available cuts across all Nexperia’s product groups and includes switching, Schottky, Zener and protection diodes, bipolar junction transistors (BJTs), N- and P-channel MOSFETs, resistor-equipped transistors and LED drivers.

Nexperia has announced a range of new silicon germanium rectifiers (SiGe) with 120, 150, and 200V reverse voltages that combine the high efficiency of their Schottky counterparts with the thermal stability of fast recovery diodes.

Nexperia has launched a family of P-channel MOSFETs in the robust, space-saving LFPAK56 (Power-SO8) package. AEC-Q101 qualified for automotive applications, the new devices are a well suited replacement for DPAK MOSFETs, offering a reduction in footprint of over 50% whilst maintaining high performance levels.

Nexperia has launched a range of ultra-tiny MOSFETs in the DFN0606 package for mobile and portable applications including wearables. The devices also offer the lowest RDS(on)for their size and employ the commonly used pitch of 0.35 mm to simplify PCB assembly processes.

Nexperia CEO Frans Scheper is taking early treatment just three months after China-based Wingtech took a controlling stake in the company.