Search results for "hydrogen power"

Flex Power Modules introduces the BMR352, a new generation of non-isolated fully regulated DC/DC converter offering the highest peak power capability in a quarter-brick form factor.

Syslogic’s AI Rugged Computer RML A4AGX, previously announced in March 2024, is designed for computer vision applications in harsh environments. With its NVIDIA Jetson AGX Orin module, it represents the new performance peak in the Syslogic range and is used to drive AI applications forward.

ITT Cannon, a global specialist in harsh environment interconnect solutions, will showcase new products alongside its robust portfolio of interconnects for transportation, industrial, aerospace, defence, and medical applications in Munich, Germany at electronica 2024 (Booth 119, Hall A2) 12–15 November 2024.

TDK, who recently launched its GENESYS AC series, has announced the introduction of the TDK-Lambda brand DUSH series in a compact DIN rail mount package.

Omron Electronic Components Europe has launched a new high power PCB relay which requires up to 51% less mounting space compared to similar 480VAC 55A relays.

Kontron, a global provider of IoT/Embedded Computer Technology (ECT), is now also using processors from the Intel N and Intel Core i3 N series as well as Intel Atom X7000 processors (code-named 'Alderlake N' and 'Amston Lake') in its FlatClient ECO Panel PC series, which offer particularly high processor and graphics capacity with low power dissipation and an excellent price/performance ratio.

FORTEC Integrated has introduced the IB962 from iBASE, a powerful Edge-AI solution.

Novosense has announced a range of high-side switches for driving traditional resistive, inductive, and halogen lamp loads in automotive body control modules (BCM) as well as large capacitive loads commonly found in the first-level and second-level power distribution within zone control units (ZCU).

Nexperia has announced that it has entered into a strategic partnership with KOSTAL that will enable it to produce wide bandgap (WBG) devices that more closely match the exacting requirements of automotive applications.

Renesas has introduced the RA8E1 and RA8E2 microcontroller (MCU) groups, extending its most powerful series of MCUs.