Search results for "congatec"

congatec has welcomed the PICMG release of the COM Express 3.0 specification. The revision 3.0 of the specification formally integrates the new Type 7 pinout type which is the basis for congatec's Server-on-Modules. The official release fires the starting shot for the race to a new generation of server designs based on standardised Server-on-Modules.

A best practice design solution for the simplified orchestration of wireless sensor networks was showcased by congatec at embedded world 2017. It is based on the new, application ready congatec Cloud API (Application Programming Interface) for IoT gateways that is capable of integrating any local sensor networks into any cloud solution.

congatec has introduced a SMARC 2.0 module supporting powerful USB-C connectivity. The utilisation of the USB-C specification makes USB interconnects even more universally applicable, further standardising the interface setup of SMARC 2.0-based embedded devices.

congatec has introduced the conga-IC175, a thin industrial-grade motherboard family featuring the 7th Gen Intel Core U (Kaby Lake) processors designed for IoT connected devices. The new boards are suited for space-constrained, high-performance, low-power IoT designs.

Comprehensive support of the IoT editions of Windows 10 has been announced by congatec. These full versions of Windows 10 are characterised by their extended security functions and lockdown options for IoT-connected appliances.

Martin C. Frederiksen has recently been appointed as the new congatec Sales Director for Northern Europe to strengthen the company’s sales and support organisation in the UK and in Scandinavia. Together with the appointment of Martin Frederiksen, the Northern European sales team has been extended further with the addition of Anders Rasmussen and Jon Moseley as Key Account Managers. Additionally, congatec has recently created a new, wholly o...

The final version 2.0 ofSGET Standardisation Group for Embedded Technologies e.V.'s SMARC design guide has been announced. The new design guide which applies to the latest SMARC 2.0 specification will be shortly released on the SGET website. Last year the SDT.01 workgroup published the new SMARC 2.0 specification to enhance the feature set and repurpose selected V1.1 pins that are currently underused for new interfaces.

congatec has released COM Express Compact modules in time with the launch of the 7th generation of Intel Core SoC processors. The conga-TC175 Computer-on-Modules (COMs) with Intel's Skylake successor -the second variant of the current 14nm microarchitecture - are simply better than their predecessors. Compelling features include greater CPU performance, more dynamic HDR graphics thanks to 10-bit video codec, and support of the optional, super-fas...

congatec extends its COM Express Basic portfolio with the new high-performance conga-TS175 Computer-on-Module. Equipped with the high-end dual chip versions of the brand new Intel Xeon and Gen 7 Intel Core processors (codename Kaby Lake), it sets a new benchmark for module-based high-end embedded computers and modular industrial workstations that need to process massive workloads.

congatec has released the conga-MA5, the next generation of low-power modules for the industrial and extended temperature range in the credit card sized COM Express Mini form factor. The new COM Express Type 10 Computer-on-Modules are equipped with the latest Intel Atom, Celeron and Pentium processors (code name Apollo Lake) and impress with 30% more processing power and 45% more graphics performance on a very small COM Express Mini module.