Search results for "chip capacitors"

The new Series 4 siliconphotodiodeshave triple the response speed (25ns vs. 80ns) compared toMarktech’s current Series 4 PDs with the same active area.

Sondrel has announced an Advanced Modelling Process for AI chip designs. This runs through every stage of a chip’s design to ‘prove’ that the design is what was specified – Functional Verification -- and that it does what it is supposed do – Performance Verification.

Mouser Electronics has announced a new global distribution agreement with American Bright LED, a supplier of LED components and integrated solutions.

The DRV8220 is an integrated motor driver with four N-channel power FETs, charge pump regulator, and protection circuitry. The charge pump integrates all capacitors to reduce the overall solution size of the motor driver on a PCB and allows for 100% duty cycle operation.

The European Processor Initiative (EPI), a project with 27 partners from 10 European countries, with the goal of helping to achieve EU independence in HPC chip technologies and HPC infrastructure has announced the first EPI Forum to be held in Barcelona, Spain, October 9-10, 2024.

Selectivesolderingof assemblies on panels is generally straightforward, but when working with large panels containing tall components, the task becomes more complex.

Following his achievement of the 2024 Millennium Technology Prize, Electronic Specifier recently spoke with the inventor of the IGBT, Professor Bantval Jayant Baliga, on what it means to him and what he hopes to see in the future.

On 4th September 2024,Silicon Labsannounced support forBluetooth Channel Soundingtechnology on its xG24 platform, marking a significant step forward in Bluetooth Low Energy (LE) ranging capabilities.

Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometres are used to create tinyelectrical connectionsbetween a semiconductor chip and other components.

Eggtronichas unveiled an evaluation board (EVB) that allows engineers to speed the development and reduce the size and cost of 240W power delivery (PD) 3.1 applications while supporting ultra-fast charging.