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Avnet Silica to feature AI demos at embedded world 2024
Avnet Silica will host a series of live demonstrations under the umbrella theme of “The engineers of evolution” at embedded world 2024 in Nuremberg (April 9 – 11).
Antenna design priorities in IoT applications
The Internet of Things (IoT) has influenced almost everyone’s life and work in recent times. For some people, their engagement with the IoT may be as simple as using a smartwatch to track their eating or exercise habits or taking advantage of the utility company’s smart meter to save energy and keep bills under control. At the other extreme, it has become possible to connect everything, including appliances, lighting, heating, door lo...
FEV senses electrical partial discharge in high-voltage vehicle propulsion systems
FEV has unveiled the PD-HVX (Partial Discharge – High Voltage X), marking a leap in the early detection and mitigation of partial discharge (PD) phenomena within high-voltage electric drive units (EDUs).
TDK presents new dual-die stray-field robust 3D position sensor
TDK Corporation is expanding its Micronas 3D HAL position sensor portfolio with the introduction of the HAR 3920-2100, a dual-die sensor tailored for automotive and industrial use.
Saelig introduces new features in Ramsey RF test enclosures
Saelig Company, Inc. announces significant upgrades to the Ramsey RF Test Enclosures lineup, catering to forensic analysis, benchtop, and rack-mount EMI-quiet enclosure needs.
KIC presents Contact-less Thermal AnalysisTM
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation in the 2024 IPC APEX EXPO, scheduled to take place 9–11 April 2024 at the Anaheim Convention Centre in California.
Thermaltronics unveils TMT-R9000S solder robot
Thermaltronics USA, a manufacturer of award-winning solder robots, is pleased to announce its participation in the 2024 IPC APEX EXPO, taking place 9–11 April 2024 at the Anaheim Convention Centre in California.
ASRock's iEPF-9030S/iEP-9030E Edge AIoT with Intel Core 14th Gen
ASRock Industrial is thrilled to release the new iEPF-9030S/iEP-9030E Series Robust Edge AIoT Platform, harnessing the power of Intel Core 14th Gen processors (Raptor Lake-S Refresh) with R680E/H610 chipsets to support up to 24 cores/32 threads, ensuring optimised edge performance.
MIRTEC to showcase 3D AOI solutions at APEX 2024
MIRTEC will showcase its complete line of 3D AOI and SPI Inspection Systems at Booth #2100 during the 2024 IPC APEX EXPO scheduled to take place April 9-11, 2024, at the Anaheim Convention Centre.
MEMS pressure sensor copes with diverse environments
The MLX90830 Triphibian MEMS pressure sensor from Melexis is now being shipped by authorised distributor Mouser Electronics.