Search results for "soldering"
Poke home WTB contacts enhance design flexibility
Designed for a wide variety of harsh industrial applications, the vertical 9296 Series signals an expansion of AVX's series of single poke home WTB contacts. Providing maximum mechanical stability and wire retention, the WTB contacts feature high spring force, dual beam, and phosphor bronze contacts. The contacts avoid the added expense of an insulator and its associated assembly costs.
MLO diplexers boast lowest profile in market
Claiming to offer the lowest profile 0603 and 0805 MLO diplexers available in the global market, the devices from AVX are based on the company's patented multilayer organic high density interconnect technology. The 0603 and 0805 MLO diplexers, when compared to equivalent LTCC devices, exhibit superior attenuation, low insertion losses, low parasitics, high heat dissipation, and excellent solderability.
IR emitter is optimised for CCTV and gaming
Expanding the company's optoelectronics portfolio, Vishay have introduced the VSMY98545 850nm infrared (IR) emitter. Based on SurfLight surface emitter chip technology, the emitter provides high drive current capability, high radiant intensity, and high optical power while providing low thermal resistivity.
Thermistors deliver R25 Values from 100kΩ to 210kΩ
Boasting enhanced stability for temperature sensing and compensation circuits, the SMD NTC thermistors from Vishay are optimized for heat counters, body thermometers, and other medical applications.
MiniLEDs deliver luminous intensity to 4900 mcd
Utilizing the latest advanced AllnGaP technology, the VLMx234.. series of power MiniLEDs have been made available by Vishay Intertechnology. The power MiniLEDs provides a typical luminous intensity of 3500 mcd and maximum luminous intensity of 4900 mcd at 70 mA while delivering improved thermal performance compared to previous-generation LEDs.
Collaboration could pave way for adoption of 3D IC thermocompression bonding
Paving the way for industrial adoption of thermocompression bonding for 3D IC manufacturing, imec and Besi have announced a partnership to develop a thermocompression bonding solution for narrow-pitch die-to-die, and die-to-wafer bonding.
Solderable top side improves power cycling capabilities
Designed to improve the power cycling capabilities of power modules, top side solderable metallization has been introduced by IXYS on 200A and 300A, 650V Trench XPTTM IGBT silicon dies. Solderable top side replaces standard bond wire connections by using the standard soldering process, thereby improving power cycling capability and increasing the surge current capabilities of the dies.
Packaging power for the next generation
The concept of hybrid and electric vehicles is far from new, but the challenges in the ascendance of the latest generation require new solutions. By Benjamin Jackson Senior Manager, Automotive Power Switch & Power Module, Product Management & Business Development, with International Rectifier.
ITF directional couplers for WiFi frequency spectrum
AVX has announced the introduction of a new integrated thin film directional coupler series for WiFi bands. Offering outstanding performance across the WiFi frequency spectrum (2,400-5,950MHz), the miniature ITF couplers feature high directivity of 20dB, low parasitics, excellent solderability, improved heat dissipation, and self-alignment during reflow.
Integrated solutions for the fourth industrial revolution
Confirming participation at Southern Electronics, HARTING has revealed that it will use the show to demonstrate its comprehensive range of integrated solutions for the smart factory of the future. Under the broad heading of “the fourth industrial revolution”, products on show include interconnectivity products for smart network infrastructures and power systems, RFID hardware and software for implementing automatic ID, and the latest ...