Search results for "NEC corporation"
Sierra Wireless announces new 5G LPWA HL7900 module
Sierra Wireless, a subsidiary of Semtech Corporation and global IoT solutions provider, has announced its latest HL Series LPWA module, the 5G HL7900, for next-generation use cases needing ultra-low power, increased device longevity and support for 3GPP’s latest 5G standards.
Vertical farming: overcoming the engineering challenges
The need to streamline production and more effectively use resources is at the heart of the rise in popularity of vertical farming, an industry that has been growing at a staggering pace in recent years, and that is widely regarded as the future of sustainable food production.
PCIe digitisers combine speed, resolution, and fast streaming
A 10GS/s sampling rate, 12-bit vertical resolution and 12.8GB/s data streaming are features of two new PCIe Digitiser cards from Spectrum Instrumentation.
Indium features metal thermal interface materials for burn-in and test at TestConX
Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, 5th-8th March in Mesa, Arizona.
RFID vs barcodes: making the right inventory management decision
There’s been much discussion of late about the relative merits of RFID vs barcodes when it comes to inventory management. In truth, the two have several characteristics in common, but there are quite a few differences too.
A gold rush to D-band and beyond
“The D-band is the new E-band” read the shirts worn by Virginia Diodes (VDI) employees at a recent microwave symposium.
Debut software stack benefitting EV charge point manufacturers and installers
Award-winning electronics design consultancy ByteSnap Design and EV charging business Versinetic will be debuting as exhibitors on stand H164 at the Installer Show, NEC, Birmingham on 27—29 June 2023.
Infineon teams up with eleQtron
Infineon and eleQtron have announced a partnership to jointly develop trapped ion Quantum Processor Units (QPUs) for scalable quantum computers.
SEMI 3D & Systems Summit 2023 opens with HI and SiP solutions
3D integration and systems for semiconductor manufacturing applications will take centre stage at SEMI 3D & Systems Summit as the event opens with experts sharing the latest developments and insights into the 3D roadmap, heterogeneous integration (HI) and system-in-package (SiP) technologies for smarter systems. Registration is open for the 26th – 28th June summit in Dresden, Germany.
Detecting metal particle contamination invisible to the human eye
Implementing stringent quality control procedures in any manufacturing facility is essential, from the raw materials stage onward. The pharmaceutical, cosmetic, industrial and food and beverage industries, in particular, pay close attention to the intrusion of contaminants – even those too small to be visible to the human eye. For instance, a minute impurity in the lithium-ion battery of a smartphone might result in capacity loss, heat gene...