Search results for "Master Bond"
PAM-4 linear transimpedance amplifiers enter production
Production versions of its four-channel (4 x 100G) 56/106 Gbit PAM-4 linear transimpedance amplifiers (TIAs) which are optimised for use in 400G optical modules targeting Cloud Data Centre applications have been announced by MACOM Technology Solutions.
One component glob top epoxy meets NASA low outgassing specifications
A new single component epoxy that is not premixed and frozen, has been introduced by Master Bond with the EP17HTND-CCM. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency suited for glob top, chip coating and bonding applications.
Remove frustration from fastening lightweight composites
It has been announced that bigHead is launching its latest product, Lean Bonding, at this year’s JEC World in Paris in March. “After several years in development, we are very excited to be releasing this major innovation onto the market.” commented bigHead’s MD, Matthew Stevens. “Lean Bonding will remove many of the frustrations and difficulties in fastening lightweight composites and thin metals.”
What is IEC 60034-23 and how does it impact me?
Have you heard about IEC 60034-23? If the answer was no, fear not. Here, Dr. Martin Killeen of the AEMT (Association of Electrical and Mechanical Trades) outlines the requirements of the international repair, overhaul and reclamation of rotating equipment standard IEC 60034-23:2018, and highlights how it impacts on both the repair provider and the end user.
Network simulator supports successful eCall test
A successful eCall (a built-in emergency call in IVS)sledge Test Demo at the ADAC Technology Centre took advantage of the performance of the Anritsu Network Simulator MD8475A. The instrument is an all-in-one base station simulator supporting LTE, LTE-Advanced, W-CDMA/HSPA/HSPA Evolution/DC-HSDPA, GSM/EGPRS, CDMA2000 1X/1xEV-DO Rev. A. and TD-SCDMA/TD-HSPA.
Partnership to expand digital signage range
Specialist provider of industrial, medical and digital technology solutions, Distec, is set to expand its range of digital media players and industrial display systems, thanks to a new partnership with global manufacturer Advantech. As an authorised Embedded Computer Channel Partner serving the UK and Ireland, Distec can now supply a wide range of Advantech solutions.
Vibration resistance with range of washers
The team working at Challenge Europe are experts at exploiting the adaptability of simple, rugged threaded fasteners, and it is this adaptability which brings engineers to their use. Simple to use and to provide with vibration resistance, improved sealing, load spreading or good looks by combining with a range of washer accessories to enhance the performance of the basic fastener.
SDK for IoT System on Chip supports debugging
IC design company based in Beijing, Winner Micro, recently released their new SDK for IoT WiFi SoC W600. The new SDK supports compiling and debugging with Eclipse + IDE + GCC + OpenOCD as well as MicroPython. Currently, IoT WiFi SoC is widely used in smart homes, smart appliances, health care, smart toys and industry.
Anritsu to brandish 5G test solutions at MWC 2019
Advanced solutions supporting the latest 5G standards and network deployments will be showcased by Anritsu at Mobile World Congress (MWC) 2019 in Barcelona (February 25-28). During the conference, Anritsu will focus on the key test and monitoring solutions for 5G device testing, Conformance Testing, eSIM, Field Installation and Testing, C-RAN deployment, Advanced Analytics and Telco Cloud Support.
Touch-operated VNA offers enhanced RF performance
The R&S ZNA high-end vector network analyser, a powerful, universal test platform for characterising active and passive DUTs has been launched by Rohde & Schwarz. The two models R&S ZNA26 (10MHz to 26.5GHz) and R&S ZNA43 (10MHz to 43.5GHz) offer a dynamic range of 146dB (typ.) and a trace noise as low as 0.001dB at 1kHz IF bandwidth.