Search results for "Infineon"

In the future it will be possible to use IGBT High Power Modules (IHM) from Infineon Technologies AG even longer. More robust construction and greatly improved thermal conductivity behaviour increase the average life time in comparison to previous models by a factor of up to 11 under the same conditions of use. A major advantage here is that the electrical and mechanical parameters of the module remain the same in spite of the necessary changes i...

New semiconductor materials could mean 50% less energy loss in switched-mode power supplies for PCs, flat-screen televisions, servers and telecommunications systems and could make solar inverters even more compact and cost-efficient. The partner companies of the research project “NeuLand” have developed highly-integrated components and electronic circuits which made it possible to reduce energy loss in circuits by 35% as early as duri...

Combining two power MOSFETs and a DC/DC driver IC with integrated current and temperature sensing, the DrBlade 2 power stage device has been introduced by Infineon. The low-profile package of the device, which uses galvanic and lamination processes to reduce footprint and height, aids engineers of server and datacom applications in handling high power density requirements and in shortening design-in cycles.

The rate of improvement in trench MOSFETs may be slowing down but, as Steve Rogerson found out, there are still some fighting the battle.

Infineon Technologies has shipped more than one billion RF switches used in smartphones and tablet products. It is expected that the demand for RF switches will show double-digit growth over the next years mainly driven by the increased number of LTE bands integrated in the next generation of smartphones and tablets.

The introduction of a series of antenna tuning ICs signals an expansion of Infineon's IC solutions for the RF front end. Instrumental in improving end user experience in 4G smartphones and tablets, the BGA1xGN10 ICs optimise antenna characteristics to allow for highest data rate operation in relevant LTE bands.

Previously requiring two sensors, the TLE4966Vvertical dual-Hall sensor from Infineon supplies information on both rotation direction and speed. The sensor is suited for energy-sensitive electronic automotive systems, such as power window and trunk lift, sun roofs and seat adjustment, as well as for escalators, electric shades and electric blinds.

Embedded Office has extended the range of its Cert-Kits and is now offering a component pre-certified on Infineon's C167 16-bit microcontroller for µC/OS-II. This real-time kernel supports manufacturers of safety-critical systems in the standard-compliant development according to DIN EN50128 SIL-4.

Developed for high-end systems in the industrial sector, Infineon Technologies has introduced the 1EDS-SRC EiceDRIVER Safe driver. The component features the first Slew Rate Control (“SRC”) adjustable in real-time at the IGBT and the secure electric isolation of complies with the strict specifications of VDE 0884-10 and has specially developed short-circuit protection functions.

Infineon Technologies announces a new leadless surface mounted (SMD) package for CoolMOS MOSFETs, designated ThinPAK 5x6. With its height of only 1mm and with its very small footprint of 5x6mm, the ThinPAK 5x6 provides 80% volume reduction in comparison to traditional SMD packages such as DPAK.