Search results for "Master Bond"
Automotive logic parts 64% smaller than leaded equivalents
Specialist in discretes, logic and MOSFET devices, Nexperia, has announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified. These logic solutions claim to be the smallest devices of their type suitable for automotive applications and Nexperia’s Q100 portfolio exceeds the Automotive Electronics Council’s requirements.
The benefits of UV curing in 3D modelling
Design teams test the aerodynamics of a Formula 1 car by putting a prototype in a wind tunnel. Using a full-size model in the testing process can be expensive and time-consuming, so development engineers often use smaller scale 3D models during testing - but how can they be sure that the prototype will be up to scratch? Simon Gibbs, Product Specialist atIntertronics, explains how design engineers can benefit from UV curing when 3D printing protot...
Software tools enhance spectrum analysers
Measuring applications for its real-time spectrum analysers were unveiled by Rigol Technologies at embedded world 2019 in Nuremberg - the Vector Signal Analysis Software VSA and the EMI Analysis Software. The RSA3000 and RSA5000 real-time spectrum analysers are based on Rigol's newly developed "Ultra Real" technology and are characterised by their compact design, operation via touch screen and their modularity for a variety of applications.
Panels with BIPV metal sheet solar roof
Swedish solar energy technology provider, Midsummer, has launched a new energy producing metal sheet roof ‘Midsummer solar roofs’. This signals a broader effort to expand from mainly selling production equipment for thin film solar panels into the end market for solar panels for various roofs, facades, and vehicles, through in-house production and via contract manufacturers.
Autonomous cars on the streets of London
Autonomous vehicles are now on the streets of London in a major test being run by autonomous technology firm FiveAI.Though the vehicles have safety drivers for now, the goal is for passenger trials by 2020, in advance of the launch of an autonomous car sharing service. Volkswagen has also just announced similar tests in Hamburg.
Added-value eshop for adhesives, sealants and coatings
It has been announced that the new Henkel eShop is a platform for adhesives, sealants and coatings, which offers a comprehensive range of support features from product selection through to delivery and everything in between. The service is available 24/7, 365 days a year.
Adhesive to support faster curing at room temperature
Specialist in silicones, silicon-based technology and innovation, Dow, has launched DOWSIL EA-4700 CV Adhesive, a next-generation silicone solution for transportation assembly that is capable of room temperature curing at faster speeds while maintaining the performance advantages expected from silicone adhesives.
The answer to all cast vinyl applications
The experienced cast manufacturers, Arlon Graphics, has different cast vinyl products that suit every application need. SLX Cast Wrap with FLITE Technology features easy release liners and maintains the integrity of graphics, enabling users to have the fastest installation in the industry. The superior repositionability of SLX Cast Wrap + FLITE Technology provides a long-term bond where it counts: deep channels, complex curves, and rivets.
3D Printing enabling personalised medical devices
One of the key industries to have successfully leveraged the advantages of 3D printing is the medical and dental industry. 3D printing allows for the creation of personalised medical devices to be streamlined, and it has also been used to improve surgical outcomes and deliver personalised medicines.
Intelligent connectivity solutions to master 5G challenges
Manufacturer of components and systems for electrical and optical connectivity, HUBER+SUHNER, will unveil its solutions for mobile network densification at booth #6G20 at this year’s Mobile World Congress. The company’s presence at the show will focus on the forthcoming topology changes necessary to prepare for the continuously growing capacity requirements and complexity of the future 5G network.