Search results for "Master Bond"
The right welding and bonding for medical devices
The essence of a medical device is its relationship to the patient. A growing trend in preventative health is wearable technology, like smart watches and monitors placed on the skin. The engineers of these devices must find solutions to make medical technology flexible and durable enough to work on a person’s wrist or hip for example. Michael Garry, AMADA MIYACHI EUROPE explains.
Southeast Asia innovation centre expanded in Singapore
Palomar hasannounced it has expanded its Innovation Centre in Singapore to further meet the growing demands of photonics companies designing and launching new high performance packages that enable the IoT and 5G wireless networks. The expansion has provided the opportunity for Palomar to add their latest die bonder designed for thedemandingassemblyneedsof advanced photonics packages -the 6532HP Die Bonderwhichexceeds industry standards for placem...
Low power Ethernet physical layer transceiver
The DP83825I from Texas Instruments is the smallest form factor, lowest power Ethernet Physical Layer transceiver with integrated PMD sublayers to support 10BASE-Te, 100BASE-TX Ethernet protocols. The DP83825I interfaces directly to twisted pair media via an external transformer. It interfaces to the MAC layer through Reduced MII (RMII) both in Master and Slave mode.
Adhesives dispensing expertise shared at FAST Live
To help the industry better tackle the challenges of technology and manufacturing using adhesives and protective materials, Peter Swanson, Managing Director at adhesives specialist Intertronics, ran a seminar at FAST Live. Swanson offered insights into dispensing technology, process validation and the latest positive displacement and jetting technologies.
STPOWER: Power transistors family from STMicroelectronics
Power technologies for both high and low voltage applications combined with a full package range and innovative die bonding technologies exemplify ST’s innovation in power transistors belonging to the STPOWER family.
SICK opens up Industry 4.0 with its first IO-Link encoder
With the launch of the SICK AHS36 (singleturn) and AHM36 (multiturn) IO-Link absolute encoders, SICK has opened up wide-ranging new possibilities to integrate rotary motion sensing into the ‘smart’ sensor configurations of automated machinery.The SICK AHS36 and AHM36 36mm IO-Link encoders are SICK’s first range of absolute encoders with IO-Link.
MPC modular plug connectors at Railtex 2019
A variety of rugged connection products from Stäubli Electrical Connectors will be on show at the Railtex exhibition in Birmingham this May. They include versatile modular connectors that can be adapted to a range of different roles. One such product is the MPC modular plug connector which is suitable for power transmission applications in electric rail vehicles.
Making plasma surface treatment portable
To give manufacturers access to high powered, portable plasma treatment,Intertronics has introduced theRelyon Plasmatool. Suitable for a range of processes, substrates and geometries, the portable surface treatment system will help manufacturers in applications where the substrate is difficult to treat because of size or location.
Automotive DC motor driver IC with LIN slave function
It has been announced that Toshiba Electronics Europe has started sample shipments of an automotive DC motor driver IC with a LIN (Local Interconnect Network) slave function that can communicate with a LIN 2.0 master IC for in-vehicle networks. The new TB9058FNG is suitable for many applications requiring up to 0.3A drive current using LIN BUS including heating, ventilation and air conditioning (HVAC) damper control drivers.
Improving efficiency in cars for electromobility
To improve the efficiency in modern cars on the way to electromobility and in challenging industrial power conversion applications the power density has to be increased without limitations on performance and reliability. Based on the AT&S ECP (Embedded Components Packaging) technology active and passive components have been integrated into PCBs for low-power designs and are used in volume production meeting high-quality requirements.