Search results for "vision systems"

At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...

SKY Perfect JSAT, NTT DOCOMO, the National Institute of Information and Communications Technology (NICT), and Panasonic jointly announced that they have successfully conducted a 5G communication verification test in the 38GHz band from an altitude of approximately 4km using a small Cessna aircraft operated by Kyoritsu Air Survey simulating the eventual use of High-Altitude Platform Stations (HAPS). The demonstration was the first of its kind in t...

Arrow Electronics and SiMa.ai have entered into a strategic collaboration, enabling Arrow to distribute SiMa.ai products in the EMEA region.

Microscopic cameras play a major role in medical applications for surgery, pathology, and diagnostics.

Weebit Nano, a leading developer and licensor of advanced memory technologies for the global semiconductor industry, and Efabless, the creator platform for chips, announce their collaboration to enable fast and easy prototyping of intelligent devices using Weebit’s technology.

ITEC has introduced the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines, attaching up to 60,000 flip-chip dies per hour.

At PCIM Europe 2024, Infineon Technologies will showcase its latest semiconductor, software, and tooling solutions addressing today’s green and digital transformation challenges.

With the increasing power requirements of artificial intelligence (AI) processors, server power supplies (PSUs) must deliver power without exceeding the defined dimensions of the server racks.

Pasternack has announced its latest product, matching pads for 50-ohm and 75-ohm transmission lines. They provide seamless transition between the two types of transmission lines.

The influence of artificial intelligence (AI) is driving up the energy demand of data centres across the globe.