Search results for "pcb"
Semiwise, sureCore, and Cadence CMOS circuit development breakthrough
In a leap towards revolutionising quantum computing and enhancing the energy efficiency of data centres, Semiwise, sureCore, and Cadence have collaborated to overcome critical challenges in developing cryogenic CMOS circuits.
New hybrid transceiver for rugged environments
Cinch Connectivity Solutions, a Bel Fuse company, and global pioneer in delivering reliable connectivity solutions, launches its highly ruggedised H28-100G-SR4 Transceiver.
KYOCERA’s wire-to-board card-edge connectors with solderless contact
KYOCERA AVX, a global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, has launched the new 9169-000 Series single-piece wire-to-board card-edge connectors.
Low-power 46 GOPs MCU comes in compact footprint
Alif Semiconductor launched the Ensemble E1C, a microcontroller (MCU) series that combines rich digital and analog capabilities with a low-power on-chip neural processing unit (NPU) in a new compact form factor.
High-performing, efficient, and space-saving 36V operational amplifiers
STMicroelectronics has rolled out the TSB952 dual operational amplifier (op amp), featuring a 52MHz gain-bandwidth and a supply current of only 3.3mA per channel at 36V, making it an ideal choice for power-efficient designs.
WIN Semiconductors releases moisture-resistant tech
WIN Semiconductorshas announced the beta release of its moisture-resistant 0.1µm pHEMT technology, PP10-29.
Schaffner’s common mode choke: superior performance, same size
Schaffner has announced the launch of a new common mode choke for industrial applications which delivers higher performance than previous versions while retaining the same mechanical volume.
STMicroelectronics reveals intelligent automotive circuit breaker
STMicroelectronics has commenced production of automotive high-side power switches featuring proprietary intelligent fuse protection and a Serial Peripheral Interface (SPI) for diagnostic data, enhancing resilience, and functional safety.
Indium introduces alloy for solder paste
Indium is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.
Cambridge GaN Devices targets high-power applications at PCIM 2024
At PCIM 2024, Electronic Specifier spoke with Cambridge GaN Devices’ (CGD) Peter Di Maso, VP of Business Development AMER at CGD, at their booth to learn more about CGD’s latest endeavours in the high power GaN space and its vision moving forward.