Search results for "nordic semiconductor"
Navitas unveils new digital control technique for AI data centres
At this month’s IEEE Energy Conversion Congress and Expo (ECCE), Navitas Semiconductor is set to debut its innovative ‘IntelliWeave’ control technique.
Insulated Wire’s new mW products catalogue
Insulated Wire has announced the availability of its 2024 High Power Microwave Products catalogue.
Efficient inspection of semiconductors and electronic components
With the ChipControl command set, EVT offers a compact, easy-to-use tool for the inspection of semiconductors and electronic components.
Seica at electronica 2024
Seica will be at Electronica to show solutions for the electronics industry that can reduce time to market and improve your business.
Alif Semiconductor to integrate ExecuTorch
Alif Semiconductor has announced it will support the ExecuTorch framework that was recently introduced by PyTorch.
Series 16 – Episode 4 – The evolving landscape of IR sensor technology
Paige West speaks with Ben White, CEO ofPhlux Technologyabout the latest innovations in the field of 1550nm infrared (IR) sensors.
Renesas four-channel master IC and sensor signal conditioner
Renesas has introduced two semiconductor solutions for the rapidly growing IO-Link market: the CCE4511 four-channel IO-Link master IC and the ZSSC3286 - IO-Link ready, dual-channel resistive sensor signal conditioner IC.
Infineon launches contactless payment card SECORA Pay Green
Infineon Technologies is paving the way to a significant reduction of plastic waste and CO2emissions in the payment card industry. The company has announced the launch of SECORA Pay Green which enables card designs allowing production of the world’s first fully recyclable contactless (dual-interface) payment card bodies based on environmentally friendly and locally sourced materials.
PIC Summit stresses aiding photon chip growth
More than 700 key figures from the semiconductor and photonic chip sectors have gathered in Eindhoven for one of the largest summits of its kind to discuss the industry's future.
Innovative bonding technologies for AI and electromobility
electronica 2024, one of the world’s most important trade fairs for electronics being held from 12–15 November 2024, will once again bring leading experts, users, and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C3, Booth 300.