Search results for "miniaturisation"

Sensors play a vital role in electronics and engineering. They measure, detect, and monitor a plethora of physical elements.

Infineon Technologies has introduced two new XENSIV barometric air pressure (BAP) sensors: the KP464 and KP466, both targeted at automotive applications.

Infineon introduces two new XENSIV barometric air pressure (BAP) sensors: the KP464 and KP466, both targeted at automotive applications.

Molex has released a report on miniaturisation in product design that highlights the cross-disciplinary engineering design and manufacturing expertise required to integrate an onslaught of increasingly sophisticated features and functionality into constantly shrinking device footprints.

ROHM revealed the BD2311NVX-LB, a gate driver IC engineered for GaN devices, capable of achieving gate drive speeds in the nanosecond range, which is crucial for high-speed GaN switching.

The potential of micro scanners in medical technology is immense. Their small size, low weight and high energy efficiency make them ideal for mobile use.

Heilind Electronics is stocking the TE HVAC components designed for harsh environment and connected home applications.

Molex has announced the results of a global survey of design engineers and managers to better understand top power-system design experiences, challenges, opportunities and attitudes that are enabling or inhibiting the development of critical power-system designs.

Murata has introduced multi-layer ceramic capacitor (MLCC) products that successfully draw on the company’s advanced resin moulding capabilities.

With Murata’s latest multi-layer ceramic capacitor (MLCC) introduction, the company is addressing the growing need for components that have elevated capacitance levels combined with miniaturised form factors and enhanced temperature performance.