Search results for "Yole"

ASM Pacific Technology (ASMPT) is acquiring Mycronic’s subsidiary Automation Engineering, Inc. (AEi),a sensor assembly and test specialist, in an all-cash transaction.

The global pandemic has focused attention on dealing with dangerous microorganisms. Viruses, as well as bacteria, have been present in the environment for longer than humans. With our capacity to create technologies, we have developed the ability to protect ourselves from these natural bio-hazards. Alain Bruno Kamwa, Product Manager Opto at Rutronik explains how UVC LEDs are powering advanced germicidal technology.

OmniVision Technologies has announced the new OAX4000, a companion image signal processor (ISP) that offers design flexibility for next-generation automotive single- and multicamera architectures, enabling OEMs to future-proof their designs for added functionality as market demands change.

Cadence Design Systems has expanded its popular Tensilica Vision DSP product family with the debut of two new DSP IP cores for embedded vision and AI. Packing a 3.8 tera operations per second (TOPS), the flagship Cadence Tensilica Vision Q8 DSP delivers two times performance and memory bandwidth compared to the Tensilica Vision Q7 DSP and energy efficiency for high-end vision and imaging applications in the automotive and mobile markets.

GaN Systems has announced accelerated momentum and customer growth signaling mainstream adoption of GaN technology to meet rapid growth of data and energy demands across key industries.

OmniVision Technologies has announced the OAX8000 AI-enabled, automotive application-specific integrated circuit (ASIC), which is optimised for entry-level, stand-alone driver monitoring systems (DMS). The OAX8000 uses a stacked-die architecture to provide the industry’s only DMS processor with on-chip DDR3 SDRAM memory (1GB).

“At Yole Développement (Yole), we expect the volume of global camera module shipments to expand from 5.5 billion units in 2019 to 8.9 billion in 2025, at 8.2% CAGR”, said Richard Liu, Technology and Market Analyst, Photonics and Sensing at Yole.

Xilinx and Continental have announced that Xilinx will power Continental’s new Advanced Radar Sensor (ARS) 540 with the Zynq UltraScale+ MPSoC platform, creating a production-ready 4D imaging radar. The collaboration enables newly-produced vehicles equipped with the ARS540 to realise SAE J3016 Level 2 functionalities and will pave the way toward Level 5 autonomous driving systems.

KEMET has continued to develop and design solutions for alternative energy, industrial/lighting, medical, defense and aerospace, and telecommunications applications with the new Tantalum Stack Polymer (TSP) O 7360-43 and the 82uF/75V rated voltage extension in Polymer Hermetically Sealed.

Developer of affordable imaging radars for the automotive industry, RFISee isunveiling the first Phased Array 4D imaging radar on a chip. RFISee's all weather radar has proven its ability to detect cars from 500 meters and pedestrians from 200 meters, with an angular resolution greater than 1°.