Search results for "NXP"
SECO at embedded world North America 2024
SECO has announced its participation in the inauguralembedded world North America, taking place in Austin, Texas, from 8-10thOctober 2024.
SEMICON India will explore smart manufacturing and more
SEMICON India 2024, set to take place from 11-13 September in Greater Noida, Delhi NCR, will bring together global leaders, semiconductor experts, academia, and government representatives.
HoverGames 3 winners’ innovative solutions for sustainable food ecosystems
Land, Sky, Food Supply – NXP HoverGames Challenge 3 announces its winners, with the top prize going to a team that developed an innovative drone that assesses the health of grape crops with AI studying the vine leaves for pests and disease.
PCIM Asia 2024 opens in Shenzhen 28th August
PCIM Asia 2024 will open its doors from 28 – 30 August at the Shenzhen World Exhibition and Convention Centre.
Kontron Web Panel with the high-performance i.MX8M Plus Processor
Kontron, one of the world's leading suppliers of IoT/Embedded Computer Technology (ECT), is presenting its new Web Panel product line based on the latest processor technology at the SPS 2023 exhibition.
NXP enriches developer experience with MCUXpresso productivity
Next-gen MCUXpresso toolset streamlines software development for complex embedded applications, adding an all-new integrated development environment (IDE) to enable use of open-source projects, simplified access to specialist middleware, and hardware abstraction to enable code reuse across NXP’s broad range of MCUs.
5G massive MIMO modules promise thinner, lighter systems
Richardson RFPD now has availability and full design support capabilities for a curated selection of product recommendations that support 3.3–3.98 GHz, 5G Thin mMIMO RF front-end development.
Silicon on insulator: from inception to cutting-edge research
Silicon on Insulator (SOI) technology has become animportant innovationin the field ofsemiconductors, driving advancements in performance, power efficiency, and thermal management of electronic devices.
Teledyne e2v releases upscreened Arm-based LX2160 processor
Teledyne e2v has announced that the company has qualified and released an upscreened version of the LX2160 to operate between -55°C to +125°C.
System on module is based on new NXP SoC
Variscite presented a working demonstration of the new VAR-SOM-MX91 system on module at the COMPUTEX 2023 conference simultaneously with NXP’s announcement of the i.MX 91 SoC.