Search results for "NFC"

Panthronics has announced an extension of the feature-rich demo kit for its PTX100R NFC Reader IC which will accelerate development of NFC applications on the Renesas Synergy family of 32-bit microcontrollers.

Electronic Specifier takes a look at the top five design products released in May.

Electronic Specifier takes a look at the top communication products to have been released in May.

EnOcean has presented the PTM 535BZ module, the latest addition to its range of transmitter modules for battery-free switch applications. In addition to the already established PTM 535 for the EnOcean wireless standard and PTM 535Z for Zigbee applications, PTM 535BZ offers a combination of supported wireless standards in the 2.4GHz radio band.

Anglia Components has announced a new partnership with Taoglas, a provider of next-generation IoT solutions. The partnership broadens Anglia’s range of existing IoT components including RF, antenna, cables and connectors.

With sensors for measuring brightness, humidity, temperature and acceleration as well as a magnetic contact for open/closed status monitoring make the STM 550 multisensor an all-rounder for smart environments and IoT.

Distributor Mouser Electronics is sponsoring the NXP Technology Days, an online training program for engineers designing solutions with embedded technology.

NXP Semiconductors announced that its Trimension Ultra-Wideband platform now offers fine ranging for new tagging use cases. UWB and Bluetooth Low Energy solutions have been combined to deliver spatial awareness to the new Samsung Galaxy SmartTag+, providing an enhanced experience to the Samsung SmartThings Find service.

TDK Corporation has developed new MLJ-H1005 inductors for use in NFC (near field communication). Mass production will begin in February 2021. The inductors' intended use is for the LC filters of NFC circuits. It is necessary for inductors to have narrow tolerances to minimise the loss caused by mismatched impedance with the antenna.

u-blox has specified Nordic’s nRF52833 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to power its NINA-B4 stand-alone Bluetooth 5.1 modules. The small (10x15x2.2mm) Bluetooth LE/Bluetooth 5.1 MCU modules with open CPU architecture are optimised for, and can be supplied preinstalled with, Wirepas Massive (previously Wirepas Mesh), a decentralised large-scale mesh networking solution.