Search results for "Master Bond"
Seica’s Corli to present at Automotive Battery Tech
Seica will be participating at Automotive Battery Tech in Berlin (September 27-29), where selected executives from well-known companies and worldwide experts discuss practices, trends, current projects and issues from automotive EV sector.
Fingerprints & Infineon announce biometric payment card solution
Fingerprint Cards and Infineon Technologies have announced the launch of SECORA Pay Bio, anall-in-one biometric payment card solutionthat meets Visa and Mastercard specifications.
Infineon announce SECORA Pay Bio
Infineon has announced SECORA Pay Bio, an all-in-one biometric payment card solution that complies with Visa and Mastercard specifications.
StratEdge semiconductor packages at EuMW & IMAPS
StratEdge has announced that it will be exhibiting in booth 923B at European Microwave Week (EuMW), being held at Porte de Versailles Paris, France from September 24-27, and booth 313 at IMAPS International Symposium for Microelectronics being held at the Encore Boston Harbor in Everett, Massachusetts, on October 1-2.
Next-gen connectivity with high-precision CPO technology
ASMPTwill participate in the upcoming European Conference on Optical Communication (ECOC) 2024, taking place from 23–25 September 2024 in Frankfurt, Germany.
New M8 12-Pin connector for demanding industrial applications
binderhas launched an M8 12-pin circular connector. This product complements the existing M8 series and sets new standards for applications in industrial sensor technology, measurement, and control technology, in camera technology, and robotics.
TFT display modules deliver optical performance suitable for outdoor use
Industrial display manufacturer JDIT-K has announced a range of TFT displays designed and developed for use in outdoor applications.
The programme: digital additive and/or 3D electronics
TechBlickhascurated a programmefeaturing over 70 invited talks, 12 industry- or expert-led masterclasses, four tours, and more than 80 onsite exhibitors.
DELO carries out studies on miniLED dice
DELO has carried out internal feasibility studies, demonstrating the successful electrical and mechanical bonding of miniLED dice using directional conductive adhesives.
KYZEN to exhibit at IMAPS 2024
KYZEN will be exhibiting at the 2024 International Symposium on Microelectronics, taking place from 1-3 October 2024 at the Encore Boston Harbor.